Vishay Intertechnology, Inc.

Vishay Sprague, Inc.

Origin Gps Ltd.

Avx Corporation

Vishay-siliconix

Neteera Technologies Ltd.

Other

Haim Goldberger

Sik Lui

Jacek Korec

Y Mohammed Kasem

Jack Van Den Heuvel

Harianto Wong

George V Gerber

Anthony E Troianello

Reuven Katraro

Alex Eidelman

Ilia Skatkov

Anatoly Agulyansky

Ehud Elron

Isaac Refaely

Nissim Cohen

Omer Eshet

Uzi Tomo

Péter Földesy

Doron Gozaly

Lilia Kushnarev

An antenna pattern integrated-on-chip for transmitting and/or receiving sub-terahertz and terahertz (THZ) signal& The antenna pattern comprising: a first conductor having a bi-circular structure; a second conductor having a bi-circular structure connected to the first bi-circular structure. The bi-circular structures comprising a first conductive circular lobe having a radius (Rx) and a second circular lobe having a radius (Rc), such that said Rx&#x2265;Rc. The first bi-circular and the second bi-circular characterized by at least one port thereby, having an area of intersection between the first bi-circular and the second lei-circular, forming an ultra-wideband (UWB) frequency response of more than about 100% bandwidth.

Ultra-wideband antenna

An integrated circuit for interfacing with one or more sensors including a wireless interface configured to connect to a network, an I/O interface configured to connect to sensors; and a microprocessor and memory that are programmed to: connect to a server via the network, wherein the server executes an application for controlling the sensors; transmit identification information and/or location information of the integrated circuit to the application executed by the server; receive commands for the sensors from the application executed by the server; and transfer the commands to the I/O interface for relaying to the sensors; and wherein the integrated circuit is configured to control any sensor that can connect electronically to the I/O interface without changing the programming of the microprocessor and memory.

Cloud programming sensor interface architecture

An imaging sensor for accepting terahertz signals, including a die made of a dielectric material, one or more antennas for receiving terahertz signals, positioned on top of the die or in an upper layer of the die, each antenna having a CMOS detector electrically coupled to the antenna and positioned in the die below the antenna, a metal shield layer in the die below the antennas and above the CMOS detectors, shielding the CMOS detector from interference signals, a shielding layer under the die comprising a back metal coating and/or a layer of silver epoxy glue for attaching the bottom of the die to a lead frame.

Terahertz CMOS sensor

An integrated circuit for interfacing with one or more sensors, including a wireless interface configured to connect to a network, an I/O interface configured to connect to sensors; and a microprocessor and memory that are programmed to: connect to a server via the network; wherein the server executes an application for controlling the sensors; transmit identification information and/or location information of the integrated circuit to the application executed by the server; receive commands for the sensors from the application executed by the server; and transfer the commands to the I/O interface for relaying to the sensors; and wherein the integrated circuit is configured to control any sensor that can connect electronically to the I/O interface without changing the programming of the microprocessor and memory.

A method of forming an integrated circuit, including providing a first substrate layer having a center piece and two side pieces on opposite sides of the center piece, assembling one or more circuit elements on a top side and a bottom side of the center piece of the first substrate layer, preparing two support pieces from a substrate, matching the size of the side pieces, coupling the support pieces to the bottom of the first substrate layer under the side pieces to form a second substrate layer with a void in the center under the center piece of the first substrate layer; and wherein the side pieces and support pieces include via connectors electrically connecting between a bottom side of the second substrate layer and the circuit elements.

Dual sided circuit for surface mounting

A method of fabricating a capacitor in a semiconductor substrate. The semiconductor substrate is doped to have a low resistivity. A second electrode, insulated from a first electrode, is formed over a front side surface and connected by a metal-filled via to the back side surface. The via may be omitted and the second electrode may be in electrical contact with the substrate or may be formed on top of the dielectric layer, yielding a pair of series-connected capacitors. ESD protection for the capacitor is provided by a pair of oppositely-directed diodes formed in the substrate connected in parallel with the capacitor. Capacitance is increased while maintaining a low effective series resistance. Electrodes include a plurality of fingers, which are interdigitated with the fingers of other electrode. The capacitor is fabricated in a wafer-scale process with other capacitors, where capacitors are separated from each other by a dicing technique.

Precision high-frequency capacitor formed on semiconductor substrate

A hybrid circuit with an integral antenna module, including an electronic circuit that includes circuit elements; and an antenna module including a dielectric material shaped to form a void enclosed by the dielectric material, a conducting patch on one side of the dielectric material. Wherein the circuit elements are enclosed by the dielectric material, so that the elements of the circuit are positioned inside the void formed by the dielectric material.

Antenna-module hybrid circuit

A method of embedding rigid elements in a windshield, including, cutting two sheets of glass in a desired shape to serve as an upper layer and lower layer of the windshield, inserting a layer of interlayer material for each of the two layers of glass, facing each other, between the two layers of glass, placing the rigid elements between the two layers of interlayer material, pushing the two layers of glass together to form a glass sandwich with the rigid elements and two layers of interlayer material between the upper and lower glass layers, heating the glass sandwich while applying pressure to form a unified sheet of glass; and wherein the combined thickness of the layers of interlayer material is at least as thick as the rigid elements.

Rigid elements embedded in a motor vehicle windshield

A precision high-frequency capacitor includes a dielectric layer formed on the front side surface of a semiconductor substrate and a first electrode on top of the dielectric layer. The semiconductor substrate is heavily doped and therefore has a low resistivity. A second electrode, insulated from the first electrode, is also formed over the front side surface. In one embodiment, the second electrode is connected by a metal-filled via to a layer of conductive material on the back side of the substrate. In alternative embodiments, the via is omitted and the second electrode is either in electrical contact with the substrate or is formed on top of the dielectric layer, yielding a pair of series-connected capacitors. ESD protection for the capacitor can be provided by a pair of oppositely-directed diodes formed in the substrate and connected in parallel with the capacitor. To increase the capacitance of the capacitor while maintaining a low effective series resistance, each of the electrodes may include a plurality of fingers, which are interdigitated with the fingers of the other electrode. The capacitor is preferably fabricated in a wafer-scale process concurrently with numerous other capacitors on the wafer, and the capacitors are then separated from each other by a conventional dicing technique.

A circuit with an integral antenna, including a hybrid circuit on a substrate, a patch antenna that is adapted to be positioned at a pre-selected distance above the hybrid circuit and coupled to the hybrid circuit to form a single physical unit, a feeder that electronically connects between the hybrid circuit and the patch antenna.

Hybrid circuit with an integral antenna

The present invention, relates to the preparation of a patch antenna with a specific effective dielectric constant; and a reduced dissipation factor. In an exemplary embodiment of the invention, size requirements and the desired resonant signal frequency dictate the permittivity value of the dielectric material to be used between the patch plate and the ground plate. Instead of using a dielectric material with the calculated permittivity value and its given dissipation factors a two layer dielectric of the same size with an effective dielectric constant that is equal to the desired dielectric constant, is used to replace the dielectric material and reduce the dissipation factor.

Miniature patch antenna with increased gain

An electronic component such as a capacitor includes a substrate having first and second principal surfaces, a dielectric layer overlaying the first principal surface of the substrate, a first electrode, and a second electrode. There is a passivation layer overlaying the first and second electrodes, a first opening being formed in the passivation layer over the first electrode and a second opening being formed in the passivation layer over the second electrode. A first bottom electrode termination is positioned in the first opening and a second bottom electrode termination is positioned in the second opening. The first bottom electrode termination is electrically connected to the first electrode and the second bottom electrode termination is electrically connected to the second electrode. A standoff is positioned between the first bottom electrode termination and the second bottom electrode termination and attached to the passivation layer to thereby provide support for the electronic component when mounted. The standoff provides resistance to tilting.

High precision capacitor with standoff

A surface mount chip capacitor includes a metal substrate, a conductive powder element including a valve metal and partially surrounding the metal substrate with the metal substrate extending outwardly from the conductive powder towards the anode end of the surface mount chip capacitor, a silver body cathode at least partially surrounding the conductive powder element, a coating formed by vapor-phase deposition surrounding the silver body cathode, an insulative material formed about a portion of the substrate extending outwardly from the conductive powder, a conductive coating formed around the metal substrate at the anode end of the surface mount chip capacitor, an end termination anode electrically connected to the conductive coating at the anode end of the surface mount chip capacitor, and an end termination cathode electrically connected to the silver body cathode at the cathode end of the surface mount chip capacitor.

Surface mount chip capacitor

A fast heat rise resistor comprising a substrate, a foil bridge on the surface of the substrate, the foil bridge having an elevated portion and a contact portion, the elevated portion above the substrate, the contact portion in contact with the substrate, a conductive layer attached to the contact portion of said foil bridge. The activation energy and/or response time is reduced as the foil bridge is suspended over the substrate. Another aspect of the invention include a method of manufacturing the foil bridge and application to autoignition vehicle airbags.

Growing community of inventors

Modiin, Israel

Haim Goldberger