Hughes Aircraft Company

Tesla, Inc.

Packard Hughes Interconnect Company

Delphi Technologies, Inc.

Maxwell Technologies, Inc.

Haim Feigenbaum

William R Crumly

Hieu Minh Duong

Christopher M Schreiber

Joon Ho Shin

John Steven Szalay

Eric Dean Jensen

Porter H Mitchell

Blake F Woith

Chris M Schreiber

Mohammed-Yazid Saidi

Jian Hong

Ziying Wang

Bao Q Le

Terry Shing Wang

David Bryan Swarbrick

Pete Henry Hudson

Alan L Kovacs

Bao Le

Mordechay Schlesinger

Harold C Bowers

Gerald P Chernicky

Randy Lee Thomas

Robert Joseph Cochrane

Long T Hoang

Robert K Betz

Dong Vo

Robert Martinez

John De Nuto

An energy storage device can include a cathode and an anode, where at least one of the cathode and the anode are made of a polytetrafluoroethylene (PTFE) composite binder material including PTFE and at least one of polyvinylidene fluoride (PVDF), a PVDF co-polymer, and poly(ethylene oxide) (PEO). The energy storage device can be a lithium ion battery, a lithium ion capacitor, and/or any other lithium based energy storage device. The PTFE composite binder material can have a ratio of about 1:1 of PTFE to a non-PTFE component, such a PVDF, PVDF co-polymer and/or PEO.

Dry energy storage device electrode and methods of making the same

Materials and methods for preparing electrode film mixtures and electrode films including reduced damage bulk active materials are provided. In a first aspect, a method for preparing an electrode film mixture for an energy storage device is provided, comprising providing an initial binder mixture comprising a first binder and a first active material, processing the initial binder mixture under high shear to form a secondary binder mixture, and nondestructively mixing the secondary binder mixture with a second portion of active materials to form an electrode film mixture.

Compositions and methods for parallel processing of electrode film mixtures

Dry process electrode films, and energy storage devices incorporating the same are described, including a silicon active material. The films may be free standing anode electrode films. Also provided are methods for fabricating such anode electrode films.

Compositions and methods for silicon containing dry anode films

An energy storage device can include a first electrode, a second electrode and a separator between the first electrode and the second electrode wherein the first electrode includes an electrochemically active material and a porous carbon material, and the second electrode includes elemental lithium metal and carbon particles. A method for fabricating an energy storage device can include forming a first electrode and a second electrode, and inserting a separator between the first electrode and the second electrode, where forming the first electrode includes combining an electrochemically active material and a porous carbon material, and forming the second electrode includes combining elemental lithium metal and a plurality of carbon particles.

Prelithiated hybridized energy storage device

An energy storage device can include a cathode and an anode, where at least one of the cathode and the anode are made of a polytetrafluoroethylene (PTFE) composite binder material including PTFE and at least one of polyvinylidene fluoride (PVDF), a PVDF co-polymer, and poly(ethylene oxide) (PEO). The energy storage device can be a lithium ion battery, a lithium ion capacitor, and/or any other lithium based energy storage device. The PTFE composite binder material can have a ratio of about 1:1 of PTFE to a non-PTFE component, such a PVDF, PVDF co-polymer and/or PEO. Methods of fabricating the anode and/or the cathode of the energy storage device are also disclosed.

A flexible circuit includes a plurality of electrical traces and a plurality of probe tips directly formed thereto. The electrical traces are made of a first electrically conductive material and the probe tips are made of a second electrically conductive material that is harder than the first electrically conductive material. The first material is copper or a copper alloy and the second material is nickel or a nickel alloy, where the second material may be plated with gold. Portions of the probe tips are exposed to facilitate electrical contact with contact pads of another electrical circuit. The flexible circuit may also include a ground layer to facilitate electrical correction with another electrical circuit at relatively high frequencies.

Flexible circuit with micro-sized probe tips and a method of making the same

Apparatus for holding and securing an electrical module, IC, or other electronic components to a PCB that is easy to use and manipulate. The apparatus utilizes a transitional element to hold the electrical module or IC and then secure itself to the PCB using fasteners or the like. Preferred methods for assembling and using the apparatus are disclosed.

De-mountable, solderless in-line lead module package with interface

A method for forming a nanolaminate structure is provided which comprises plating a substrate with layers of substantially a first metal and substantially a second metal using an electrolytic plating process and controlling the plating current to obtain a desired current density at the cathode, which is maintained within a predefined range.

Commercial plating of nanolaminates

A method for attaching an integrated circuit to a flexible circuit which includes the acts of providing an integrated circuit having a plurality of contact pads formed upon a surface thereof; providing a flexible circuit possessing a plurality of contact bumps formed integral to a surface area; and attaching the integrated circuit to the flexible circuit by fusing at least some of the contact bumps of the flexible circuit to at least some of the contact pads of the integrated circuit. The contact bumps have a shape which mitigates local stress buildup within the contact bumps after attachment of the contact bumps to the contact pads, so as to enhance the reliability of the electrical connection.

Method for joining an integrated circuit

A Z-axis electrical interconnect includes a flexible printed circuit folded into a U-shape. The Z-axis electrical interconnect also includes a plurality of raised interconnection members arranged on the flexible printed circuit in a predetermined pattern and a circuit trace interconnecting the pair of raised interconnection members. The Z-axis electrical interconnect further includes a spring fixedly positioned on the flexible printed circuit to maintain the U-shape.

Z-axis electrical interconnect

The present invention includes composite support substrate for both flexible and rigid board circuit applications and method of making the same. The composite substrate is composed of at least two materials formed under the circuitry. A first material is a conventional matrix such as a polyimide/acrylic adhesive, and a second material having unique properties that are useful locally in isolated locations. For instance, the second material may be nonporous to moisture, optically clear, and/or thermally conductive. The second material is integrated into the circuit matrix at specific localized areas where desired with portions coplanar with the first material so that circuit traces remain continuous as they pass from the first material to the second. For example, an integrated circuit chip may be isolated from the polyimide matrix, which is porous in moisture, by using the second material that is nonporous to moisture at locations where the integrated circuit chip is to be attached, thus isolating the integrated circuit chip from the polyimide and preventing moisture from flowing through to the chip.

Bumps with plural under-bump dielectric layers

Growing community of inventors

Irvine, CA, United States of America

Haim Feigenbaum