Wuhan China Star Optoelectronics Technology Co., Ltd.

Hailong Pan

Guowei Zha

Fancheng Liu

Chao Wang

Guangkun Liu

Xinpei Hu

A backlight module and a display device are provided in the present application. In the backlight module, alight modulation surface of the annular light modulation portion is connected to an end of a corresponding light incident surface away from a physical center, and in a direction from the physical center to the annular light modulation portion, a degree of an acute angle between the light modulation surface and the light incident surface is sequentially increased; or, a light modulation surface corresponding to the annular light modulation portion is connected to an end of a corresponding light incident surface near the physical center, and in the direction from the physical center to the annular light modulation portion, the degree of the acute angle between the light modulation surface and the light incident surface is sequentially increased.

Backlight module including angular deflection film and display device including the same

Provided are a manufacturing method of a liquid crystal display and the liquid crystal display. In the manufacturing method of the liquid crystal display, a transparent flexible film is formed on an array substrate, and then, connection pins are formed on the transparent flexible film, and then, a portion of the transparent flexible film formed with the connection pins is fixed on a side of the array substrate away from an opposite substrate by bending, which can reduce a frame width of a liquid crystal display panel to achieve a narrow frame display.

Manufacturing method of liquid crystal display and liquid crystal display

A display device and a manufacturing method of the display device are provided. The display device includes a first substrate, and a flip chip film. The first substrate is provided with bonding pins, conductive adhesive layers, and barriers. Each bonding pin is extended to a side edge of the first substrate, and each bonding pin includes a connecting surface which is flush with the side edge of the first substrate. Each conductive adhesive layer covers one side of each bonding pin, each conductive adhesive layer is extended to the side edge of the first substrate, and the conductive adhesive layer includes an auxiliary connecting surface which is flush with the side edge of the first substrate. Each barrier surrounds side surfaces of each conductive adhesive layer. The flip chip film is connected to the connecting surface and the auxiliary connecting surface.

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Wuhan, China

Hailong Pan