Invensense, Inc.

Haijun She

Brian H Kim

Mozafar Maghsoudnia

Muhammad Maaz Qazi

A device includes a substrate, a micro-electro-mechanical system (MEMS) device disposed on the substrate, a controller disposed on the substrate, a heating element, and an enclosure. The heating element is configured to generate heat in response to a signal generated by the controller. The enclosure encloses the MEMS sensor device, the controller, and the heating element. The controller is configured to generate the signal responsive to temperature measurements within the enclosure. The signal causes the heating element to generate heat and maintain a predetermined temperature within the enclosure.

Temperature stabilizing enclosure

A Micro Electro Mechanical systems (MEMS) device includes a solder bump on a substrate, a CMOS-MEMS die comprising a CMOS die and a MEMS die, and stud bumps on the CMOS die. The MEMS die is disposed between the CMOS die and the substrate. The stud bumps and the solder bumps are positioned to provide an electrical connection between the CMOS die and the substrate.

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San Jose, CA, United States of America

Haijun She