Aac Microtech (changzhou) Co, , Ltd.

Aac Acoustic Technologies (shenzhen) Co., Ltd.

Huawei Technologies Co., Limited

Haijuan Yang

Shuwen Wu

Lei Zhang

Yingyu Zhang

Xinyu Huang

Jiancheng Xu

Lifeng Wu

Jingbo Peng

The present disclosure discloses a speaker box including a metal cover fixed between the frame and the magnetic circuit system; the metal cover includes a bottom wall set at a bottom of the speaker unit and a side wall extending from the bottom wall and set at a side of the speaker unit; the vibration system, the frame, the metal cover and the magnetic circuit system enclosing a internal space of the speaker unit; the bottom wall and/or the side wall are provided with leak structures formed by stamping communicating the internal space and the rear cavity, the leak structure comprising a bar-shaped through-hole and a bar-shaped bulge corresponding to the bar-shaped through-hole. The present disclosure provides a speaker box can be flexibly applied to a variety of complex shapes of the housing and can enhance the filling amount of sound-absorbing powder.

Speaker box

The present disclosure discloses a speaker box including a cover fixed between the frame and the magnetic circuit system; the cover includes a bottom wall set at a bottom of the speaker unit and a side wall extending from the bottom wall and set at a side of the speaker unit; the vibration system, the frame, the cover and the magnetic circuit system enclosing a internal space of the speaker unit; the cover is hot pressed from polyethylene glycol terephthalate film, the bottom wall is provided with an array of first leakage holes communicating the internal space and the rear cavity, the side wall is provided with an array of second leakage holes communicating the internal space and the rear cavity. The speaker box can be flexibly applied to a variety of complex shapes of the housing and can enhance the filling amount of sound-absorbing powder.

The present disclosure provides a speaker module. The speaker module includes a housing body, a vibration system, and a magnetic circuit system. The housing body includes a support frame having a through cavity, a front cover mounted on the through cavity opening side of the support frame, and a back cover mounted on the side of the support frame away from the front cover. The vibration system, the support frame and the back cover are enclosed to form a back cavity. The support frame includes an integrally injection-molded conductive element. This configuration of the present disclosure can simplify the manufacturing process of the speaker module, and reduce the application cost.

Speaker module

The present invention provides a speaker box. The speaker box includes a housing, a speaker unit, and an air-permeable spacer assembly accommodated in the housing. The air-permeable spacer assembly includes a bracket and an air-permeable spacer fixed to the bracket. The housing includes a bottom wall and a side wall. The bracket includes an annular main body and a leg. The air-permeable spacer is attached to the annual main body. The annular main body is fixed to the side wall. The leg is fixed to the bottom wall. At the same time, the bracket can be easily and conveniently adapted to various complex shapes of the housing through the annular main body and the leg. In addition, the filling amount of the sound absorbing powder can be increased.

A speaker module includes a housing, a vibration system, and a magnetic circuit system. An accommodation space is defined in the housing, the vibration system is accommodated in the accommodation space, and the magnetic circuit system is accommodated in the accommodation space and is configured to drive the vibration system. The housing includes a supporting frame, a front cover, and a rear cover. The vibration system and the magnetic circuit system are directly assembled with the housing to obtain the loudspeaker module. Compared with the related art, an assembling process of the speaker module is simplified from two separate assembly processes of a speaker and a module into single assemble process of the speaker, which provides a simple assembling process and further reduces the cost.

Speaker module and assembling method thereof

Embodiments of the present invention disclose a buffer state reporting method and apparatus. The buffer state reporting method includes: triggering transmission of current buffer state report BSR information of a user equipment; and if the user equipment will transmit media access control protocol data unit MAC PDU data packets to a base station and the MAC PDU data packets include a newly transmitted MAC PDU data packet, carrying the BSR information in the newly transmitted MAC PDU data packet for transmission to the base station. In the buffer state reporting method and apparatus of the embodiments of the present invention, when multiple MAC PDUs are transmitted at the same time, BSR information is carried in a newly transmitted MAC PDU, so that a base station acquires BSR information on a user side in a timely manner, thereby improving performance of uplink scheduling for a user.

Growing community of inventors

Shenzhen, China

Haijuan Yang