Boe Technology Group Co., Ltd.

Beijing Zhongxiangying Technology Co., Ltd.

Haijin Wang

Hong Wang

Jianmin Wu

Yu Wang

Jianfeng Zeng

Dong Chai

Chuan Wang

Jiawei Ren

Yu Feng

Fan Zhang

Jing Xue

Nan Liu

Tian Lan

Wangqiang He

Minyang Deng

Lijun Zeng

The present disclosure provides data processing methods and apparatuses, an electronic device and a storage medium. The method includes: obtaining a product sample set; obtaining combination features in specified dimensions of the product sample set by processing a second parameter based on a preset dimension reduction algorithm; obtaining influence scores respectively for the combination features in specified dimensions based on a first parameter and the combination features in specified dimensions; obtaining at least one combination feature ranked top by sorting the combination features based on the influence scores, and taking a raw parameter corresponding to the at least one combination feature as a cause of the product defect. In the embodiments of the present disclosure, combination features in R dimensions may be a combination of raw parameters having similarity such that similar parameters are associated while raw information of the product samples is retained, thus helping fast locating the cause of the product defect, and improving the detection efficiency.

Data processing methods and apparatuses, electronic device and storage medium

The present disclosure provides a method for processing defect information of a product, which includes the following steps of: acquiring defect information on a current film layer and defect information on historical film layers; determining whether defect information exists at a target location of the historical film layer if defect information exists at a target location of the current film layer; if defect information exists for a corresponding location to the target location in at least one of the historical film layers, deleting the defect information detected at the target location in the current film layer; and if no defect information exists for the target location in any of the historical film layers, retaining the defect information detected at the target location in the current film layer. According to this, for the defect information on the current film layer, only the defect information caused by factors of the current film layer may be retained, and the defect information caused by the historical film layers will not be retained, and thus, on the one hand, the stored data volume may be reduced, and on the other hand, the complexity of subsequent analysis of defect information may be simplified.

Methods and devices for processing and retrieving defect information of product

A data processing method includes: obtaining a defect type of a sample set in response to a first input of a user on a first interface, the sample set including samples, each sample having a first parameter used to represent a defect degree of the sample with regard to the defect type and a second parameter used to represent device informations of sample production devices through which the sample passes; calculating yield purity indexes of sample production devices on the samples based on first parameters and second parameters of the samples, so as to obtain influencing parameters of the sample production devices, an influencing parameter of each sample production device being used to represent an influence degree to which the sample production device affects an occurrence of the defect type on the samples; and displaying the influencing parameters of the sample production devices on a second interface.

Data processing method, device and system, and electronic device

A computer-implemented method for defect analysis is provided. The computer-implemented method includes obtaining a plurality of sets of defect point coordinates, a respective set of the plurality of sets of detect point coordinates including coordinates of defect points in a respective substrate of a plurality of substrates, the coordinates of defect points in the respective substrate being coordinates in an image coordinate system; combining the plurality of sets of defect point coordinates according to the image coordinate system into a composite set of coordinates to generate a composite image; and performing a clustering analysis to classify defect points in the composite set in the composite image into a plurality of clusters.

Computer-implemented method for defect analysis, apparatus for defect analysis, computer-program product, and intelligent defect analysis system

A method for querying a product history is disclosed. The method includes receiving a product query request including at least one product query parameter for a target product to a product graph database that stores a relational map constructed based on a manufacturing process of the target product and describing entities including product entities and manufacturing entities and entity relations therebetween involved in the manufacturing process, querying the product graph database according to the product query parameter to obtain product history data of the target product by searching for a product entity corresponding to the target product as a target product entity in the relational map according to the parameter, searching for associated manufacturing entities of the target product entity according to the entity relations, obtaining the product history data based on the associated manufacturing entities, and sending a notification message to notify obtained product history data.

Method, system, device and medium for querying product history

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Beijing, China

Haijin Wang