Telefonaktiebolaget Lm Ericsson (Publ)

Boe Technology Group Co., Ltd.

Ordos Yuansheng Optoelectronics Co., Ltd.

Haijiang Wang

Ruijun Hao

Pengjun Chen

Shuaijun Li

A heatsink and a communication device having the heatsink are disclosed. The heatsink comprises a heatsink base and a plurality of heatsink fins. Each heatsink fin includes a fin bottom joined to the heatsink base and a fin top opposite to the fin bottom. A plurality of flow channels are formed in at least one of the heatsink fins to extend obliquely from the fin bottom towards the fin top. The plurality of flow channels merge into a public channel formed at the fin top.

Heatsink and communication device having the heatsink

The present disclosure relates to a package box and a liner for the same. The package box includes a hexahedral outer box body; a cover configured to cover an opening of the outer box body; a substantially hexahedral liner placed in the outer box body and having six side walls, at least one of which side walls is configured to be a movable side wall, each movable side wall being slidably coupled with the adjacent four side walls to change the volume of the liner; and at least one resilient member disposed between each movable side wall and the wall of the outer box body facing the movable side wall, or between each movable side wall and the cover respectively, to drive each movable side walls to move towards and to get in close contact with articles placed within the liner.

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Beijing, China

Haijiang Wang