Honeywell International Inc.

Momentive Performance Materials Gmbh

Wacker Chemie Ag

Haigang Kang

Ya Qun Liu

Liqiang Zhang

Huifeng Duan

Kai Zhang

Ling Shen

Yu Wang

Shreedhar Bhat

Wei Jun Wang

Murali Mg

Titash Mondal

Rongwei Pan

Jinqian Chen

Yaqin Mao

The present technology provides a curable silicone-based composition comprising a hybrid silicone polymer, a catalyst, and a filler. The present technology provides a curable silicone composition comprising a polymer A comprising an organic molecule or a siloxane molecule comprising an alkoxy radical, a hydroxyl radical, an isocyanate radical, a primary amine, or a carboxylic radical; optionally a polymer B comprising an organic molecule, a siloxane molecule, or a hybrid-siloxane molecule; a catalyst; and a filler.

Curable silicone-based compositions and applications thereof

The present disclosure provides a silicone free gel that is useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The thermal interface material includes a polyether polyol, a cross-linker, a coupling agent, an antioxidant, a catalyst, and at least one thermally conductive filler.

Silicone-free thermal gel

A thermal interface material that is useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The thermal interface material includes at least one silicone oil, and at least one thermally conductive filler.

Gel-type thermal interface material

The present disclosure provides a two component releasable thermal gel that is useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The two component releasable thermal gel is mixed before the point of application and facilitates catalytic cross-linking. The thermal gel includes a first component including a primary silicone oil, an inhibitor, a catalyst, and at least one thermally conductive filler, and a second component including a primary silicone oil, a cross linking silicone oil, and at least one thermally conductive filler, wherein the ratio of total content of Si&#x2014;H groups to total content of vinyl groups in the thermal gel is between 0.03 to 10. The thermal gel is releasable from a substrate upon which the thermal gel is applied.

Releasable thermal gel

The present disclosure provides thermal interface materials that are useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The thermal interface material also includes a coloring agent selected from the group consisting of: an iron based inorganic pigment; and an organic pigment.

Thermal interface materials including a coloring agent

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Shanghai, China

Haigang Kang