Boe Technology Group Co., Ltd.

Ordos Yuansheng Optoelectronics Co., Ltd.

Hewlett Packard Enterprise Development LP

Tsinghua University

Hangzhou H3c Technologies Co., Ltd

Beijing New Building Materials Public Limited Company

Haidong Wang

Hong Liu

Fengguo Wang

Liang Tian

Xing Zhang

Peng Wang

Xinguo Wu

Rui Wang

Yezhou Fang

Zhixuan Guo

Ju Wang

Shilin Zhang

Chi Fan

Guohua Chen

Shunlin Zhou

Kai Lin Li

Yu Feng

Yue Yang

Dong Zhang

Bo Ma

Wei Xin

Ce Zhang

Dayong Tang

Shicheng Song

Yulin Cui

Desheng Li

Hongxu Zhang

Hexin Liu

Liang Feng

Huigang Wang

Tieliang Yu

The present disclosure provides a display substrate, a manufacturing method thereof, and a display device. The display substrate includes a base substrate and a plurality of pixels arranged on the base substrate, each pixel includes a plurality of sub-pixels, and each sub-pixel includes a first active layer, a first gate insulation layer, a gate electrode, a second gate insulation layer, a second active layer, a first insulation layer, a source electrode and a drain electrode laminated one on another. The source electrode is connected with the first active layer through a via hole penetrating through the first insulation layer, the second gate insulation layer and the first gate insulation layer, and the source electrode and the drain electrode are connected with the second active layer through a via hole penetrating through the first insulation layer.

Display substrate, manufacturing method thereof, and display device

An array substrate, a display panel including the same, and a display device are provided. The array substrate includes: a base substrate and a planarization layer on the base substrate. A first conductive layer is disposed on a side of the planarization layer away from the base substrate. A first passivation layer is disposed on a side of the first conductive layer and the side of the planarization layer not being covered by the first conductive layer, away from the base substrate, and provided with a plurality of stress release openings. An insulating layer is disposed in the stress release openings and on a side of the first passivation layer away from the planarization layer. A second conductive layer is disposed on a side of the insulating layer away from the planarization layer.

Array substrate, display panel including the same, and display device

Provided is a Raman spectroscopy method for simultaneously measuring a temperature and a thermal stress of a two-dimensional film material in situ. The method includes: providing the two-dimensional film material including a suspended part and a supported part and measuring Raman signals of the suspended part and the supported part; establishing equations of a Raman shift with temperature and a Raman shift with thermal stress for each of the suspended part and the supported part, and solving simultaneous equations to obtain coefficients with temperature and thermal stress; and scanning a characteristic Raman spectrum field of the two-dimensional film material and obtaining a temperature distribution and a thermal stress distribution of the two-dimensional film material according to the characteristic Raman spectrum field in combination of the coefficients of the Raman shift with temperature and the Raman shift with thermal stress.

Raman spectroscopy method for simultaneously measuring temperature and thermal stress of two-dimensional film material in situ

Disclosed are an array substrate, a display panel and a display device. The array substrate includes: a base substrate provided with a bonding region for packaging a chip on film, and a first electrode structure, an interlayer dielectric layer, a second electrode structure and a third electrode structure sequentially arranged on the base substrate, the orthographic projections of the first electrode structure, the interlayer dielectric layer, the second electrode structure and the third electrode structure on the base substrate being located in the bonding region. The array substrate further includes protection layers located between the first portion of the second electrode structure and a third electrode and between the second portion of the second electrode structure and the third electrode respectively; and the protection layers cover the side end face of the first portion and the side end face of the second end surface.

Array substrate, display panel and display device

The present invention discloses a method for communication among different components, including integrating a Network Forwarding Component (NFC) for forwarding messages and at least one Independent Application Component (IAC) for performing other service processing into one network device; setting at least one cooperation mode in the NFC and each of the at least one IAC; and communicating with each other, by the NFC and the at least one IAC, according to the at least one cooperation mode. The cooperation mode may be any or any combination of a host mode, a mirror mode, a redirection mode and a pass-through mode. According to the present invention, the NFC and the IAC may communicate according to the cooperation mode so as to ensure that the NFC and the IAC can cooperate to provide various service capabilities including message forwarding and other additional service capabilities.

Network apparatus and method for communication between different components

Growing community of inventors

Beijing, China

Haidong Wang