Xiamen Pvtech Co., Ltd.

Haibo Hong

Fuxing Lu

Liangliang Cao

Longyin Chen

Sijia Wang

Downlight

An industrial lighting device having sensing function is provided, which includes a driving module, a light-emitting module and a sensing module. The driving module includes a driving box and a driving box cover connected to each other. The driving box includes a circuit board and a sensing module connecting sheet disposed on the circuit board. The driving box cover has a sensing module installation hole. The light-emitting module has a driving module installation hole. The driving box cover passes through the driving module installation hole to fix the driving module at the light-emitting module. The sensing module is detachably disposed in the sensing module installation hole and contacts the sensing module connecting sheet so as to electrically connect to the circuit board.

Industrial lighting device having sensing function

A lighting device control circuit includes an input voltage generating circuit and color temperature adjusting circuit. The color temperature adjusting circuit includes an encoder switch and first voltage adjusting element. The encoder switch includes a first main pin, first auxiliary pin, second main pin, second auxiliary pin, main common pin, auxiliary common pin and switch element. The main common pin and the auxiliary common pin are connected to a grounding point. The switch element selectively connects two of the above pins to each other. The positive electrode of a first light source is connected to the grounding point and the negative electrode thereof is connected to the first main pin, first auxiliary pin and second auxiliary pin. The positive electrode of a second light source is connected to the grounding point and the negative electrode thereof is connected to the second main pin via the first voltage adjusting element.

Lighting device control device having color temperature adjusting function

An industrial lighting device includes a driving module, a main light-emitting module and a top light-emitting module. The driving module has a top surface and a protrusion portion. The main light-emitting module is fixed at the protrusion portion. The top light-emitting module is disposed on the top surface, and includes a heat dissipation base, a top light source board and a top cover. The heat dissipation base is provided with a base body, an outer wall and a central fixation portion. The central fixation portion is disposed at the center of one side of the base body. The outer wall is disposed on the base body and surrounds the central fixation portion, such that an accommodating space is formed between them. The top light source board is disposed in the accommodating space and the top cover is disposed on the outer wall in order to cover the accommodating space.

Industrial lighting device having integrated-type top light-emitting module

An ultra-thin downlight with enhanced thermal dissipation performance includes a housing, a light source board and a light cover. The housing includes a first ring portion, a cylindrical portion and a second ring portion connected to each other. The cylindrical portion is disposed between the first ring portion and the second ring portion, such that an accommodating space is formed between the first ring portion, the cylindrical portion and the second ring portion. The light source board is fixed on the inner surface of the second ring portion and disposed in the accommodating space. A portion of the light source board is covered by the second ring portion and the other portion of the light source board is exposed from the second ring portion. The light cover is disposed on the inner surface of the first ring portion.

Ultra-thin downlight with enhanced thermal dissipation performance

A shared mold manufacturing method for industrial lighting devices includes the following steps: putting a metal material in a mold to execute a casting molding step to generate a semi-finished product; the semi-finished product has a plate portion and a box portion disposed on the plate portion; taking the semi-finished product from the mold and performing a cooling step to cool the semi-finished product; performing a separating step to separate the plate portion from the box portion; executing a re-processing step for the plate portion and the box portion in order to obtain a heat sink and a driver; and performing a combining step to combine the heat sink with the driver.

Growing community of inventors

Fujian, China

Haibo Hong