Electro Scientific Industries, Inc.

Other

Imra America, Inc.

Haibin Zhang

Glenn Simenson

David Barsic

Patrick Leonard

Qian Xu

Jeffrey Howerton

Robert Hainsey

Wayne Crowther

Peter R Herman

Mathew Noel Rekow

Gyu Cheon Cho

Mark Alan Unrath

Hisashi Matsumoto

Jingzhou Xu

Alan Y Arai

James Bovatsek

James Brookhyser

Clint R Vandergiessen

James N O'Brien

Fumiyo Yoshino

Michael John Darwin

Andy E Hooper

Fang Shan

Chuan Yang

Martin Orrick

Shane Michael Eaton

Min Zhang

Joe Frankel

Jack Rundel

Matthew Pysher

Makoto Yoshida

A laser processing system includes a first positioning system () for imparting first relative movement of a beam axis along a beam trajectory () with respect to a workpiece (), a processor for determining a second relative movement of the beam axis () along a plurality of dither rows, a second positioning system () for imparting the second relative movement, and a laser source () for emitting laser beam pulses. The laser beam pulses of individually selected energies can be directed to individually selected transverse spot locations () one or more times during a primary laser pass to permit three-dimensional patterning. The laser beam pulses can also be directed to the spatially identical, overlapping, or non-overlapping neighboring spot area locations on the workpiece in a temporally nonsequential order.

Fast beam manipulation for cross-axis miromaching

The invention is method, and an apparatus for performing the method having the steps of providing a workpiece, generating a plurality of free electrons at a region of the exterior surface, and machining a portion of the workpiece adjoining the first region by directing laser energy onto the workpiece.

Method and apparatus for machining a workpiece

The present invention provides a direct laser writing fabrication method and system for devices having periodic refractive index modulation structures, for example, Bragg gratings. By focusing a modulated pulsed laser beam into a transparent material substrate, a path of laser modified volumes can be formed with modified refractive index compared with the unprocessed material. Modulation of exposure conditions provides periodic or modified periodic waveguide structures such that the waveguide structures exhibit grating responses and can be used for a variety of optical applications, for example, as spectral filters, Bragg reflectors, grating couplers, grating sensors, or other devices. The method enables direct one-step fabrication and integration of periodic or modified periodic refractive-index modulation devices together with other optical waveguiding devices to enable low-cost, multifunctional one-dimensional, two-dimensional or three-dimensional optical circuit fabrication of simple and complex optical systems.

Multipulse system for writing waveguides, gratings, and integrated optical circuits

Methods and apparatus for separating substrates are disclosed, as are articles formed from the separated substrates. A method of separating a substrate having first and second surfaces includes directing a beam of laser light to pass through the first surface and, thereafter, to pass through the second surface. The beam of laser light has a beam waist located at a surface of the substrate or outside the substrate. Relative motion between the beam of laser light and the substrate is caused to scan a spot on a surface of the substrate to be scanned along a guide path. Portions of the substrate illuminated within the spot absorb light within the beam of laser light so that the substrate can be separated along the guide path.

Method and apparatus for separation of strengthened glass and articles produced thereby

Methods for separation of strengthened glass

The present invention is a method for separating a workpiece from a common substrate. It includes the steps of providing the workpiece, generating, within a beam source, a beam of laser pulses configured to modify a portion of the workpiece, determining a depth for creating a modified region based upon a characteristic of the workpiece and modifying a plurality of regions within the workpiece to form a plurality of modified regions. Modifying the plurality of regions includes directing the beam of laser pulses from an output of the beam source onto the workpiece, causing relative motion between the workpiece and the output of the beam source while directing the beam of laser pulses onto workpiece, and modifying a characteristic of the pulses of the beam upon generating a number of pulses which generally correspond to creating the modified regions to the determined depth.

Method and apparatus for separation of workpieces and articles produced thereby

Disclosed is a method for creating a mark desired properties on an anodized specimen and the mark itself. The method includes providing a laser marking system having a controllable laser pulse parameters, determining the laser pulse parameters associated with the desired properties and directing the laser marking system to mark the article using the selected laser pulse parameters. Laser marks so made have optical density that ranges from transparent to opaque, white color, texture indistinguishable from the surrounding article and durable, substantially intact anodization. The anodization may also be dyed and optionally bleached to create other colors.

Method and apparatus for reliably laser marking articles

Methods and apparatus for machining substrates are disclosed, as are articles formed from the separated substrates. A method of machining a substrate having a first surface and a second surface opposite the first surface can include forming a first recess in the substrate extending from the first surface toward the second surface, forming a second recess in the substrate extending from the second surface toward the first surface, and removing a portion of the substrate extending from the first recess to the second recess to form an opening in the substrate.

Method and apparatus for machining strengthened glass and articles produced thereby

Methods, devices, and systems for ultrashort pulse laser processing of optically transparent materials are presented, with example applications in scribing, marking, welding, and joining. For example, ultrashort laser pulses create multiple scribe features with one pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. Slightly modifying the ultrashort pulse laser processing conditions produces different types of sub-surface marks. When properly arranged, these marks are clearly visible with correctly aligned illumination through either light scattering or light reflection and nearly invisible without illumination. Transparent material other than glass may be utilized. A method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating. In some embodiments of transparent material processing, a multifocus beam generator simultaneously forms multiple beam waists spaced depthwise relative to the transparent material, thereby increasing processing speed.

Transparent material processing with an ultrashort pulse laser

The invention is a method and apparatus for creating a color and optical density selectable visible mark on an anodized aluminum specimen. The method includes providing a laser marking system having a laser, laser optics and a controller operatively connected to said laser to control laser pulse parameters and a controller with stored laser pulse parameters, selecting the stored laser pulse parameters associated with the desired color and optical density, directing the laser marking system to produce laser pulses having laser pulse parameters associated with the desired color and optical density including temporal pulse widths greater than about 1 and less than about 1000 picoseconds to impinge upon said anodized aluminum.

The invention is a method and apparatus for creating marks on an anodized aluminum specimen with selectable color and optical density. The method includes providing a laser marking system having a laser, laser optics and a controller operatively connected to said laser to control laser pulse parameters. The laser marking system is directed to produce laser pulses having laser pulse parameters associated with the desired color and optical density in the presence of a fluid directed to the surface of the anodized aluminum specimen while marking.

The invention relates to devices having periodic refractive index modulation structures and fabrication methods for the devices using a laser means. By focusing a pulsed laser beam into a transparent material substrate, a path of laser modified volumes can be formed with modified refractive index compared with the unprocessed material. By selecting appropriate laser parameters and relative scan speed, the laser modified path defines an optical waveguide. Separation distance of the individual modified volumes define a periodic modification pattern along the waveguide path, so that the waveguide structures also exhibit grating responses, for example, as spectral filters, Bragg reflectors, grating couplers, grating sensors, or other devices. This method of direct laser fabrication enables one-step fabrication and integration of periodic or aperiodic refractive-index modulation devices together with optical waveguiding properties to enable low-cost, multifunctional 1D, 2D or 3D optical circuit fabrication for simple and complex applications.

Optical devices and digital laser method for writing waveguides, gratings, and integrated optical circuits

A solution to failure mechanisms caused by mechanical sawing of a mechanical semiconductor workpiece entails use of a laser beam to cut and remove the electrically conductive and low-k dielectric material layers from a dicing street before saw dicing to separate semiconductor devices. A laser beam forms a laser scribe region such as a channel in the electrically conductive and low-k dielectric material layers, the bottom of the channel ending on a laser energy transparent stop layer of silicon oxide lying below all of the electrically conductive and low-k dielectric material layers. The disclosed process entails selection of laser parameters such as wavelength, pulse width, and fluence that cooperate to leave the silicon oxide layer stop layer completely or nearly undamaged. A mechanical saw cuts the silicon oxide layer and all other material layers below it, as well as the substrate, to separate the semiconductor devices.

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Portland, OR, United States of America

Haibin Zhang