Delta Electronics (shanghai) Co., Ltd

Delta Electronics, Inc.

Haibin Xu

Shouyu Hong

Tao Wang

Zhenqing Zhao

Weicheng Zhou

Yicong Xie

Wei Cheng

Weiqiang Zhang

Ganyu Zhou

Yan Tong

Chao Ji

Min Zhou

Yiqing Ye

Qingdong Chen

Liping Sun

Juan Cheng

Xin Zou

Dongfang Lian

Zengsheng Wang

Zhengfen Wan

Haiyang Cao

A switching module includes a substrate, a switching element, a first control part, a second control part, a first power part and a second power part. The switching element is disposed on the substrate. The switching element includes a first control terminal, a second control terminal, a first power terminal and a second power terminal. The first control part is connected with the first control terminal of the switching element. The second control part is connected with the second control terminal of the switching element. A projection area of the first control part on a reference plane intersects with a projection area of the second control part on the reference plane at one or more first intersections. The first power part is connected with the first power terminal of the switching element. The second power part is connected with the second power terminal of the switching element.

Switching module

A power module and a carrier board are disclosed. The carrier board includes a circuit board body and a prefabricated substrate. The circuit board body includes a wiring layer. The prefabricated substrate is embedded in the circuit board body and includes an insulation layer and a metal layer, the metal layer is disposed on the insulation layer. The insulation layer is formed by a ceramic material. The metal layer is connected to the insulation layer through a sintering process. A surface of the insulation layer, which has contact with the at least one metal layer, has at least a part exposed outside of the at least one metal layer, the part of the insulation layer exposed to the outside of the at least one metal layer is an outer edge portion, and the outer edge portion is extended into the circuit board body along a horizontal direction.

Carrier board and power module using same

A power module structure includes a first metal layer, a second metal layer, a third metal layer and a fourth metal layer, wherein the fourth metal layer is connected to the second metal layer via a connecting bridge; at least one first switch including a first end connected to the third metal layer and a second end connected to the second metal layer; and at least one second switch including a third end connected to the fourth metal layer and a fourth end connected to the first metal layer; wherein the projection of the first metal layer and the projection of the third metal layer are overlapped to form a first overlapping area; wherein the direction of the current flowing through the first metal layer is opposite to the direction of the current flowing through the third metal layer.

Power module structure

A power module assembly is disclosed and includes a package body, a first wiring layer, a capacitor, and a system bus set. The package body includes a first surface, a second surface and two switches connected in series to form a bridge arm between the first surface and the second surface. The first wiring layer is disposed on the first surface. The capacitor is connected in parallel with the bridge arm to form a first high-frequency loop. The system bus set includes a positive-electrode bus and a negative-electrode bus fanned out from the first surface, respectively. The projection of the positive-electrode bus or/and the negative-electrode bus on the first surface is at least partially overlapped with the projection of the two switches on the first surface. The bridge arm is electrically connected between the positive-electrode bus and the negative-electrode bus to form a second high-frequency loop.

Power module assembly

A power module is disclosed. The power module includes a carrier board, two switches, at least one metal block, a clamping component and a metal conductive component. The carrier board includes an upper surface and a lower surface. The two switches are disposed on the upper surface and connected in series to form a bridge arm electrically connected between a positive terminal and a negative terminal. The metal block is electrically connected to the two switches. The clamping component is disposed on the upper surface and electrically connected in parallel with the bridge arm through the carrier board. The metal conductive component is connected from a common node of the two switches to an output terminal. The metal conductive component is located at a side of the two switches facing away from the upper surface.

Power module

A carrier board and a power module using the same are disclosed. The carrier board includes a main body, two metal-wiring layers and at least one metal block. The main body includes at least two terminals and a surface. The two terminals are disposed on the surface. The two metal-wiring layers are disposed on the main body to form two parts of metal traces connected to the two terminals, respectively. The at least one metal block is embedded in the main body and connected to one of the two terminals. A thickness of the two parts of metal traces is less than that of the metal block. The two terminals connected by the two parts of metal traces have a loop inductance less than or equal to 1.4 nH calculated at a frequency greater than 1 MHz.

There is provided a magnetic core component and the gap control method thereof. The magnetic core component includes a first magnetic component, a second magnetic component and a first gap control structure disposed therebetween. The first gap control structure includes thixotropic material and is applied on the first magnetic component and is cured, the second magnetic component is disposed on the cured first gap control structure, and a gap between the first magnetic component and the second magnetic component is controlled by an effective height of the first gap control structure. The gap control structure has minimum variability after it is cured, and its effective height can be always kept at a required gap height.

Magnetic core component and gap control method thereof

The present disclosure relates to a power module and a manufacturing method thereof. The power module includes: a group of switch elements, a molding part and a connector. The group of switch elements includes at least one pair of switch elements. The molding part molds the group of switch elements. The connector includes a signal terminal and a power terminal respectively electrically connected to the signal end and power end of the group of switch elements, and both fanned out from the molding part. The power terminal includes a positive power terminal, a negative power terminal and an output power terminal. The positive power terminal and the negative power terminal are respectively a first metal layer and a second metal layer which are at least partially stacked, and an insulating layer is disposed between the first metal layer and the second metal layer.

Power module and manufacturing method thereof

A package structure includes a substrate, at least one electronic component, a housing and at least one strut. The at least one electronic component is disposed on a first surface of the substrate. The housing covers the first surface of the substrate. The housing has an accommodation space. The at least one electronic component is accommodated within the accommodation space. The at least one strut is protruded from an inner surface of the housing and extended toward the accommodation space. The at least one elastomer is arranged between the corresponding strut and the substrate.

Growing community of inventors

Shanghai, China

Haibin Xu