Shanghai Micro Electronics Equipment (group) Co., Ltd.

Shanghai Micro Electronics Equipment Co., Ltd.

Hai Xia

Feibiao Chen

Yuebin Zhu

Song Guo

Xiaoyu Jiang

Tianming Wang

Liwei Wu

Bin Yu

Lin Zhang

Lili Zhao

Jie Fang

Jianqi Sun

Yaping Ge

Hailin Cheng

Yeqin Zheng

Jinchun Li

Subing Duan

Donghao Zhang

A chip bonding apparatus includes a chip separation unit, a chip alignment unit, a chip bonding unit and a bonding robotic arm unit. The bonding robotic arm unit includes a first bonding robotic arm unit and a second bonding robotic arm unit. The first bonding robotic arm unit includes a first motion stage, a first driver configured to drive the first motion stage and at least one first bonding robotic arm arranged on the first motion stage. The first bonding robotic arm is configured to suck up a chip from the chip separation unit and deliver it to the chip alignment unit. The second bonding robotic arm unit includes a second motion stage, a second driver configured to drive the second motion stage and at least one second bonding robotic arm arranged on the second motion stage.

Chip bonding device

A chip bonding apparatus and method are disclosed. The chip bonding apparatus includes: at least one separation module for separating chips; at least one bonding module for bonding the chips a substrate; a transportation device for transporting the chips between the separation module and the bonding module, the transportation device including one or more guide tracks and one or more transportation carriers for retaining the chips, each of the guide tracks is provided thereon with at least one of the transportation carriers; and a control device for individually controlling the separation module, the bonding module and the transportation device. The chip bonding apparatus and method allows pickup, transportation and chip-to-substrate bonding of chips in batches with increased chip bonding yield and improved chip bonding accuracy.

Chip bonding device and bonding method thereof

A universal chip batch-bonding apparatus and method. The apparatus comprises a material pick-and-place area and a transfer work area. The material pick-and-place area comprises a blue tape pick-and-place area () for providing a chip () and a substrate pick-and-place area () for placing a substrate (), the blue tape pick-and-place area () and the substrate pick-and-place area () being separately arranged at two ends of the transfer work area. The transfer work area sequentially comprises a chip pickup and separation area (), a chip alignment and fine-tuning area (), and a chip batch-bonding area () in a direction running from the blue tape pick-and-place area () to the substrate pick-and-place area (). A chip carrier transfer apparatus () is provided in the transfer work area, and the chip carrier transfer apparatus () passes through the transfer work area and is used to move and supply materials among the chip pickup and separation area (), the chip alignment and fine-tuning area (), and the chip batch-bonding area (). By means of a compatible design, the apparatus is suitable for both die-up and die-down attachment modes, expanding the application scope of the apparatus. In addition, the modular design can be configured according to requirements, increasing market potential.

Universal chip batch-bonding apparatus and method

A batch bonding apparatus and bonding method. The bonding apparatus comprises: a chip supply unit () for providing a chip () to be bonded; a substrate supply unit () for providing a substrate; a transfer unit () for transferring the chip () between the chip supply unit () and the substrate supply unit (); and a pickup unit () disposed above the chip supply unit (), for picking up the chip () from the chip supply unit () and uploading the chip () to the transfer unit () after flipping a marked surface of the chip () in a required direction. In the present invention pickup of each chip is completed individually, but transfer processes and bonding processes can be carried out for multiple chips at the same time, greatly increasing yield.

Batch bonding apparatus and bonding method

A chip bonding device is disclosed, including a first motion stage (), a second motion stage (), a chip pickup element (), a transfer carrier (), a chip adjustment system (), a bonding stage () and a control system (). A chip bonding method is also disclosed, in which a set of chips are temporarily retained on the transfer carrier () and their positions on the transfer carrier () are accurately adjusted by using the chip adjustment system (), followed by bonding the chips on the transfer carrier () simultaneously onto the substrate (). With this batch bonding approach, flip-chips can be bonded with greatly enhanced efficiency. Moreover, picking up and bonding chips in batches can balance times for chip picking up, fine chip position tuning and chip bonding, thereby ensuring high bonding accuracy while increasing the throughput.

Chip bonding apparatus and method

Provided are a chip bonding apparatus and bonding method. The apparatus comprises: a chip supply unit (); a substrate supply unit (); a first pick-up assembly () arranged between the chip supply unit () and the substrate supply unit (), comprising a first rotating component and a first pick-up head arranged on the first rotating component; a second pick-up assembly () comprising a second rotating component and a second pick-up head arranged on the second rotating component, wherein the first pick-up assembly () picks up a chip () from the chip supply unit () or the second pick-up assembly (), and delivers the chip () onto a substrate of the substrate supply unit () to complete the bonding; and a vision unit () for realizing the alignment of the chip () and the substrate on the first pick-up assembly (), wherein the chip supply unit (), the substrate supply unit (), the second pick-up assembly () and the vision unit () are respectively located on four work positions of the first pick-up head. The chip () is transported through rotation, improving the productivity of chip () bonding; and the chip () is reversed by utilizing the second pick-up assembly (), which is compatible with two ways of bonding, i.e. a mark face of the chip () facing upwards and downwards.

Chip bonding apparatus and bonding method

A six-degree-of-freedom linear motor is disclosed, including a magnet array and a coil group disposed above the magnet array, the magnet array includes a first Halbach magnet array and a second Halbach magnet array, the first Halbach magnet array has a parallelogrammic cross section in a plane defined by X- and Y-axes, the first Halbach magnet array has a first side parallel to the Y-axis and a second side forming an angle of &#x3b8; with the Y-axis, the second Halbach magnet array is in mirror symmetry with the first Halbach magnet array with respect to the Y-axis, and the coil group includes a first, second, third and fourth coil group, each having an axis inclined at an angle of &#x3b8; with respect to the Y-axis, the first and second coil groups are in mirror symmetry with the third and fourth coil groups with respect to the Y-axis, respectively.

Six-degree-of-freedom linear motor

A split-type aerostatic bearing for supporting a moving table to move frictionlessly on a platform () is disclosed. The split-type aerostatic bearing includes an aerostatic bearing plate (), air floating elements () disposed on a bottom of the aerostatic bearing plate () and a vacuum pre-tightening structure () disposed on the aerostatic bearing plate (). The vacuum pre-tightening structure () is coupled to the aerostatic bearing plate () in a split fashion. Separation of the air floating elements () from the vacuum pre-tightening structure () prevents the aerostatic bearing plate () from bending under a vacuum pre-tightening force, and hence will not affect the air floating area.

Growing community of inventors

Shanghai, China

Hai Xia