Samsung Electronics Co., Ltd.

Hai-jeong Sohn

Jun-Young Jeon

Se-yong Oh

Young-Hee Song

Han-gu Sohn

Young-hee Song

Sei-jin Kim

Woo-seop Jeong

Circuits and methods for controlling data I/O operations in semiconductor memory devices to provide variable data I/O widths for read, write and active memory operations. Circuits and methods for selectively controlling a data width of a data I/O buffer 'on the fly' to enable variable data I/O widths during memory access operations.

Circuits and methods for providing variable data I/O width for semiconductor memory devices

Semiconductor module

Semiconductor package

Disclosed is a semiconductor device wherein the down bonding and the mounting of multi-pin is made possible. A conductive member adhered to the bottom surface of the semiconductor element. The conductive member and the specific pad of the semiconductor element are connected by the connecting member, which enables the entire bottom surface of the semiconductor element to be used for down bonding. Further, the more effective latch-up suppression, noise dispersion and speed improvement compared with the conventional LOC-type package structure is possible.

Down-bonded lead-on-chip type semiconductor device

Growing community of inventors

Suwon, South Korea

Hai-jeong Sohn