Xmems Labs, Inc.

Xmems Taiwan Co., Ltd.

Hai-Hung Wen

Chiung C Lo

Jemm Yue Liang

Wen-Chien Chen

Chun-I Chang

David Hong

Martin George Lim

Hsien-Ken Liao

Lei Chen

JengYaw Jiang

Chao-Yu Chen

Wei-Yang Li

Jengyaw Jiang

An acoustic package structure includes a substrate, a covering structure and an acoustic chip. The covering structure is disposed on the substrate and has a plurality of first openings. The acoustic chip is disposed between the substrate and the covering structure, wherein the acoustic chip includes a membrane.

Acoustic package structure and covering structure

A covering structure disposed within a sound producing package includes a first portion, a second portion and a third portion. The first portion is configured to form a first sound outlet having a first diameter. The second portion is configured to form a chamber having a second diameter. The third portion is configured to form a second sound outlet having a third diameter. Wherein, the first sound outlet, the chamber and the second sound outlet provide an acoustic pathway, the first diameter is smaller than the second diameter, and the third diameter is smaller than the second diameter; and wherein, the second portion is disposed between the first portion and the third portion.

Covering structure, sound producing package and related manufacturing method

A sound producing package structure configured to produce sound includes a substrate, a sound producing component and a conductive adhesive layer. The sound producing component is disposed on the substrate, and the sound producing component is configured to generate an acoustic wave corresponding to an input audio signal. The conductive adhesive layer is disposed between the substrate and the sound producing component by a surface mount technology.

Sound producing package structure and method for packaging sound producing package structure

A package structure includes a housing and a sound producing chip. The sound producing chip is disposed within the housing. The sound producing chip includes a membrane and an actuator. The membrane includes a coupling plate and a spring structure connected to the coupling plate. The actuator is configured to receive a driving signal to actuate the membrane. The spring structure is situated between the coupling plate and the actuator. The coupling plate is actuated to move by the actuator via the spring structure.

Package structure and methods of manufacturing sound producing chip, forming package structure and forming sound producing apparatus

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Hsinchu County, Taiwan

Hai-Hung Wen