Samsung Display Co., Ltd.

Haeyoung Yoo

Myungsoo Huh

Juhee Lee

Seungho Choi

Cheollae Roh

Kanghee Lee

Hyunwoo Joo

TaeJong Kim

Voronov Alexander

Jaekyu Park

Soo Beom Jo

Jiwon Yeon

Yongmun Chang

An electrostatic chuck fixes a substrate and includes a first area and a second area adjacent to the first area. The electrostatic chuck includes a first electrode portion disposed in the first area and a second electrode portion disposed in the second area. The first electrode portion has a first width, and the second electrode portion has a second width smaller than the first width.

Electrostatic chuck

Provided is a display device manufacturing apparatus and a manufacturing method of a display device. The display device manufacturing apparatus includes: a chamber; a supporter arranged in the chamber and supporting a substrate; an electrode arranged in the chamber so as to face the supporter; a gas supply arranged in the chamber and configured to supply process gas into the chamber; a first baffle arranged at a rim of the supporter and having at least one first through hole; and a second baffle arranged between the first baffle and the chamber and covering the at least one first through hole in a plan view to alter a path of by-products discharged from the chamber.

Display device manufacturing apparatus and method

A sputtering apparatus includes a substrate holder, a first counterpart target area, a second counterpart target area, and a power supply. The first counterpart target area includes a first target and at least one first magnetic part and operates to form a magnetic field in a first plasma area adjacent to the first target. The second counterpart target area includes a second target and at least one second magnetic part and operates to form a magnetic field in a second plasma area adjacent to the second target. The power supply supplies a first power voltage to the first and second targets. A control anode faces the substrate holder in a second direction, with the first and second plasma areas therebetween, and receives a control voltage greater than the first power voltage.

Sputtering apparatus and sputtering method using the same

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Asan-si, South Korea

Haeyoung Yoo