Samsung Electronics Co., Ltd.

Haengjin Lee

Taehwan Oh

Sangmin An

Minchul Jun

Byeongcheol Choi

Changseok Han

A method of manufacturing a multi-chip package (MCP) is provided. The MCP includes a first type semiconductor chip, a second type semiconductor chip, and a memory controller configured to control the second type semiconductor chip. The method includes mounting the first type semiconductor chip and the memory controller on a substrate, mounting the second type semiconductor chip on the first type semiconductor chip, forming a mold layer to cover the first and second type semiconductor chips and the memory controller, performing a function test on the first type semiconductor chip and simultaneously determining whether a crack defect occurred in the second type semiconductor chip. The crack defect of the second type semiconductor chip is determined when a current measured in a low power mode test of the second type semiconductor chip is greater than or equal to a test reference value.

Growing community of inventors

Anyang-si, South Korea

Haengjin Lee