Stats Chippac Pte. Ltd.

Haengcheol Choi

Il Kwon Shim

KyungOe Kim

Ki Youn Jang

Taewoo Kang

Rajendra D Pendse

Oh Han Kim

Kyung Moon Kim

A method of manufacture of an integrated circuit packaging system includes: providing a substrate; forming a mold gate on an upper surface of the substrate; mounting an integrated circuit to the substrate; and forming an encapsulant encapsulating the integrated circuit, the encapsulant having disruption patterns emanating from the mold gate and underneath a bottom plane of the integrated circuit.

Integrated circuit packaging system with substrate mold gate and method of manufacture thereof

An electronic system is provided including forming a substrate having a radiating patterned pad, mounting an electrical device having an external interconnect over the radiating patterned pad with the external interconnect offset from the radiating patterned pad, and aligning the external interconnect with the radiating patterned pad.

Electronic system with expansion feature

An integrated circuit mount system includes an integrated circuit, a solder mask for the integrated circuit, and a solder mask pad on the substrate with the solder mask.

Integrated circuit mount system with solder mask pad

Growing community of inventors

Ichon-si, South Korea

Haengcheol Choi