Samsung Electronics Co., Ltd.

Haeng-Il Kim

Kwang-Soo Jung

Gun-Yong Lee

A printed circuit board and a pad apparatus having a solder deposit formed on the pad apparatus by using a mask having a slit are provided. The slit has the same shape as the solder deposit. The solder deposit includes first and second end portions individually shaped and sized to completely cover at an end portion of the pad a predetermined area of an end portion of the pad, the area defined by both the entire width of the pad and a predetermined length from the end of the pad. A connection web extends between the two end portions to integrate the two end portions into a single structure and is a longitudinal part having a width smaller than any one of both the width of the pad and the width of each of the two end portions. First and second trapezoidal portions are respectively formed at junctions between opposite ends of said connection web and one of the two end portions. The mask has a slit formed at a position corresponding to the position of the solder deposit. This slit includes first and second end opening parts corresponding to the two end portions of the solder deposit, a web opening part corresponding to the connection web, and first and second trapezoidal opening parts respectively formed at junctions between opposite ends of said web opening part and said two end opening parts and corresponding to the first and second trapezoidal portions of the solder deposit.

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Kyunggi-do, South Korea

Haeng-Il Kim