Lg Innotek Co., Ltd.

Haehyung Lee

Hyuksoo Lee

Eunjin Kim

Jungho Lee

Hyungyu Park

Inhee Cho

Jaeman Park

Youn Mo Jeong

A backlight unit including a bottom sash, a light guide plate received by the bottom sash, a substrate on which a light emitting device is mounted, the light emitting device irradiating light to the light guide plate, a fixing member fixing the substrate, and a sliding moving part fixing the fixing member in such a manner that the fixing member moves with respect to the bottom sash, wherein the sliding moving part includes a sliding bar and a sliding guide which are formed in the bottom sash and the fixing member respectively.

Backlight unit

The present invention relates to a heat radiating printed circuit board (PCB) and a chassis assembly having the same, the heat-radiating PCB characterized by: a circuit pattern unit; and one or more mounting units bent from the circuit pattern unit to be fixed at a chassis providing a lightguide path of a backlight unit, where the circuit pattern unit includes a driving unit divided into a plurality of driving regions and at least one or more electrodes for supplying a power to the driving unit, and where, the mounting unit is arranged with an electrode line for connecting the driving unit and electrodes other than the electrode arranged on the circuit pattern unit, such that dimming and scanning functions can be performed whereby illumination can be finely controlled, the width of the circuit pattern unit can be narrowed and damage to the PCB caused by heat can be prevented.

Heat radiating printed circuit board and chassis assembly having the same

The present invention relates to a heat radiating printed circuit board (PCB) and a chassis assembly having the same, the heat-radiating PCB characterized by: a circuit pattern unit mounted with a light emitting diode; and one or more mounting units bent from the circuit pattern unit to be fixed at a chassis providing a lightguide path of a backlight unit, where one of the mounting units is mounted to the chassis via a thermal interface material to maximize the heat radiating characteristic of the PCB and to reduce the manufacturing cost.

Growing community of inventors

Seoul, South Korea

Haehyung Lee