Lg Innotek Co., Ltd.

Hae Sik Kim

Jee Heum Paik

Duck Hoon Park

Dong Mug Seong

Tae Hoon Han

Hyo Won Son

Sang Yu Lee

Jong Min Yun

Su Hyeon Cho

Sang Beum Lee

Woo Young Chang

Na Kyung Kwon

Eun Sung Seo

Jung Shik Baik

Sung Won Kang

Young Joon Son

Yeong Deuk Jo

Hyun Joon Jung

So Hee Choi

A circuit board according to an embodiment includes: an insulating part; and a pattern part disposed on the insulating part, wherein the insulating part includes first and second insulating regions spaced apart from each other with an open region interposed therebetween, the pattern part includes: a first terminal portion disposed in a plurality of first side regions of the first insulating region adjacent to the open region; a second terminal portion disposed on a plurality of second side regions of the second insulating region facing the plurality of first side regions with the open region interposed therebetween; and a connecting portion disposed in the open region and connecting between the first and second terminal portions, wherein the connecting portion includes a plurality of bent portions connecting between the first terminal portion and the second terminal portion disposed in the first side region and the second side region which do not face each other and formed at a plurality of corners of the open region, the plurality of bent portions are bent to rotate in the same direction as each other, each of the first terminal portion, the second terminal portion, and the connecting portion includes a metal layer and a surface treatment layer disposed on the metal layer, and the metal layer includes a first metal layer and a second metal layer that is disposed on the first metal layer and has an electrical conductivity different from that of the first metal layer.

Circuit board, lens driving device, and camera module including the same

A substrate for display comprises one surface, the other surface, a first area (folding area) and a second area (non-folding area). A first hole passing through the one surface and the other surface is formed on the first area. A 1-1 groove is formed on one surface of the first area in the direction from the one surface to the other surface. A 1-2 groove is formed on the other surface of the first area in the direction from the other surface to the one surface. A 2-1 groove is formed on one surface of the second area in the direction from the one surface to the other surface. A 2-2 groove is formed on the other surface of the second area in the direction from the other surface to the one surface. The 1-1 groove and 1-2 groove and the 2-1 groove and 2-2 groove do not overlap each other in the thickness direction of the substrate for display.

Substrate for display including plurality of holes and grooves

A display substrate according to the embodiment includes a base material containing chromium and iron, wherein the base material includes a surface portion and a central portion, the surface portion is defined as a depth region from a surface of the base material to a depth of 5 nm in a thickness direction of the base material, and a ratio of chromium atoms to iron atoms (Cr/Fe) of the surface portion is greater than that of the central portion.

Substrate for display

A display substrate according to an embodiment relates to a display substrate comprising a display panel installation area and a bezel area. The display substrate comprises one surface and the other surface opposite to the one surface, and the display substrate comprises: a first area which is defined as a folding area; and a second area which is defined as an unfolding area, wherein a groove is formed on the one surface or the other surface of the display substrate and formed in the display panel installation area of the first area, and a hole is formed through the one surface and the other surface of the display substrate and formed in the bezel area of the first area.

Display substrate and display device comprising same

An image sensor substrate according to an embodiment includes: an insulating layer including a first open region; and a first lead pattern part disposed on the insulating layer, wherein the first lead pattern part includes: a first pattern part disposed on the insulating layer; a connection portion extending from the first pattern part; and a second pattern part connected to the first pattern part through the connection portion, wherein the second pattern part and the connection portion are disposed to fly on a region not overlapped with the insulating layer in a vertical direction.

Image sensor substrate

A substrate for display has one side or the other side thereof folded to face each other, has a first region defined as a folding region and a second area defined as an unfolding region, and has a plurality of first through-holes formed in the first region and a plurality of second through-holes formed in the second area, a second through-hole comprising a 2-1 opening area which opens to the one side, and a 2-2 opening area which opens to the other side, and the size of the 2-1 opening region Of at least one second through-hole being different from the size of the 2-2 opening area thereof.

A circuit board according to an embodiment includes an insulating layer; and a lead pattern portion disposed on the insulating layer, wherein the lead pattern portion includes: a first portion disposed on the insulating layer; and a second portion extending from one end of the first portion; wherein the first portion is disposed overlapping the insulating layer in a vertical direction, wherein the second portion is disposed in an outer region of the insulating layer and does not overlap the insulating layer; and wherein the lead pattern portion has a centerline average roughness in a range of 0.05 μm to 0.5 μm or a 10-point average roughness in a range of 1.0 μm to 5.0 μm.

Circuit board

A display substrate according to the embodiment includes: a base material having a long direction and a short direction, and including one surface and the other surface, and a first region and a second region; and a hole passing through the one surface and the other surface of the base material, wherein the first region is defined as a folding region in which the one surface is folded to face, the second region is defined as an unfolding region, the hole includes a first hole formed in the first region, and the first hole includes at least three first holes having different sizes in the long direction of the base material.

A circuit board according to an embodiment includes an insulating portion; and a pattern portion disposed on the insulating portion, wherein the insulating portion includes: a first insulating region, and a second insulating region disposed outside the first insulating region and spaced apart from the first insulating region with a separation region therebetween; wherein the pattern portion includes: a first pattern portion for signal transmission; and a second pattern portion including a dummy pattern separated from the first pattern portion, wherein the first pattern portion includes: a first terminal portion disposed on the first insulating region; a second terminal portion disposed on the second insulating region; and a connection portion disposed on the separation region and connecting between the first terminal portion and the second terminal portion, wherein the second pattern portion includes: a second-first pattern portion disposed on the first insulating region; and a second-second pattern portion disposed on the second insulating region and separated from the second-first pattern portion.

Circuit board, an image sensor module, a lens driving device, and a camera module including the same

A metal plate to be used in the manufacture of a deposition mask comprises: a base metal plate; and a surface layer disposed on the base metal plate, wherein the surface layer includes elements different from those of the base metal plate, or has a composition ratio different from that of the base metal plate, and an etching rate of the base metal plate is greater than the etching rate of the surface layer. An embodiment includes a manufacturing method for a deposition mask having an etching factor greater than or equal to 2.5. The deposition mask of the embodiment includes a deposition pattern region and a non-deposition region, the deposition pattern region includes a plurality of through-holes, the deposition pattern region is divided into an effective region, a peripheral region, and a non-effective region, and through-holes can be formed in the effective region and the peripheral region.

Growing community of inventors

Seoul, South Korea

Hae Sik Kim