Samsung Electro-Mechanics Co., Ltd.

Hae Kyo Seo

Jin Won Lee

Seung Eun Lee

Yong Hoon Kim

Jae Woong Choi

Moon Hee Yi

An antenna substrate includes a skin layer containing an insulating material, a ground layer containing a conductive material, an insulating layer disposed between the skin layer and the ground layer and including an insulating material different from the insulating material of the skin layer, a plurality of patch antennas disposed between the ground layer and the skin layer, a shielding member disposed between the ground layer and the skin layer, spaced apart from the plurality of patch antennas, and connected to the ground layer, and a shielding post connected to the shielding member, and protruding further than an outer surface of the skin layer, from the shielding member in a direction facing the skin layer, at least a portion of the shielding post being disposed between the plurality of patch antennas.

Antenna substrate and electronic device including the same

The present disclosure relates to a printed circuit board. The printed circuit board includes a core layer; a through portion penetrating through the core layer; a first via disposed to be spaced apart from an inner wall of the through portion within the through portion; and a second via disposed in the first via and having a diameter different from that of the first via.

Printed circuit board

A radio frequency package includes a first connection member having a first stack structure including at least one first insulating layer and at least one first wiring layer; a second connection member having a second stack structure including at least one second insulating layer and at least one second wiring layer; a core member including a core insulating layer and disposed between the first and second connection members; and a first chip antenna disposed to be surrounded by the core insulating layer. The first chip antenna includes a first dielectric layer disposed to be surrounded by the core insulating layer; a patch antenna pattern disposed on an upper surface of the first dielectric layer; and a feed via disposed to at least partially penetrate the first dielectric layer, providing a feed path of the patch antenna pattern and connected to the at least one first wiring layer.

Growing community of inventors

Suwon-si, South Korea

Hae Kyo Seo