Samsung Electronics Co., Ltd.

Hae-Gu Lee

Hyung-Su Son

Dong-Su Han

Jin-Yeol Yang

Joo-Hyung Lee

Young-Min Kim

A laser processing method includes irradiating a laser light into a substrate along a cutting line to form a laser-scribed layer within the substrate, irradiating an X-ray onto a first surface of the substrate along the cutting line, obtaining an image of a diffracted X-ray from the substrate, and determining whether or not the laser-scribed layer is formed along the cutting line, based on analysis of the obtained image of the diffracted X-ray.

X-ray topographic apparatus and substrate processing system using the apparatus

An adhesive tape sticking apparatus includes a chamber includes a lower chamber and an upper chamber. The lower chamber includes a first inner space and the upper chamber includes a second inner space. An adhesive tape sheet is positioned between the upper chamber and the lower chamber. A substrate support is movable upward and downward within the lower chamber and is configured to support a substrate. A differential pressure generator is configured to generate a differential pressure between the first inner space and the second inner space. A tape support plate positioned between a first sidewall of the lower chamber and a circumferential edge of the substrate. The tape support plate is configured to contact at least a portion of the adhesive tape sheet when the adhesive tape sheet bends downward toward the first inner space when the differential pressure is generated between the first and second inner spaces.

Adhesive tape sticking apparatus and method of manufacturing a semiconductor package using the same

Laser processing method, substrate dicing method and substrate processing system for performing the same

Growing community of inventors

Asan-si, South Korea

Hae-Gu Lee