Hitachi, Ltd.

Hachidai Nagase

Katsuyoshi Suzuki

Tatsuki Ishii

Tetsuo Sasaki

Yousuke Nagao

An interconnection path layout in a circuit structure having terminals arranged in rows, such as a semiconductor integrated circuit. Paths are first assigned to selected obstruction-free terminal pairs to be interconnected, and then bypasses are assigned to the remaining obstruction-existing terminal pairs to be interconnected. This minimizes the occurrence that the terminal pairs are left un-interconnected. Also, longer vertical paths are assigned to selected terminal pairs with priority. This prevents the reserved paths from becoming obstructions to vertical paths which are later assigned to selected terminal pairs.

Circuit structure, semiconductor integrated circuit and path routing

A method of automatic wiring in a semiconductor integrated circuit device having four or more wiring layers, with the lowest layer being a terminal layer, is intended to overcome the prior art problem in which lower layers are mostly used for wiring and upper layers are not used efficiently. The method is designed to assign longer lines to upper layers distant from the terminal layer, and upper layers can have increased wiring densities with minimal numbers of lines, bends and through holes, thereby using upper layers efficiently.

Method of automatic wiring in a semiconductor device

A method and a system for assisting mending of an LSI after it has been formed into a chip which is necessitated by modification of logic etc. The mending includes corrections by connecting or cutting interconnections of the LSI. The assisting method and system provides a method and a system for detecting which interconnection or connections should be subjected to mending according to the logic modification, or a method and a system for detecting an area or areas where the intended mending can be carried out, or a method and a system for advising a mending-allowable rate of the LSI. This invention further provides a wiring structure suited for mending of the LSI and a wiring method for the same. By this method, a wiring structure which preliminarily has a mending area in preparation for possible modification in logic is produced.

Growing community of inventors

Hadano, Japan

Hachidai Nagase