Samsung Electronics Co., Ltd.

Samsung Life Welfare Foundation

Ha-Young Kim

Jae-Woo Seo

Jung-Ho Do

Tae-Joong Song

Sung-We Cho

Sang-Hoon Baek

Dal-Hee Lee

Sanghoon Baek

Taejoong Song

Moo-Gyu Bae

Seung-Young Lee

Sun-Young Park

Sang-Kyu Oh

Sungwe Cho

Keunho Lee

Jae-Ha Lee

Jintae Kim

Jong-Hoon Jung

Gi-young Yang

Jinyoung Lim

Kwangok Jeong

Jin-Young Lim

In-gyum Kim

Dong-yeon Heo

Sunyoung Park

Donghyun Kim

Jin Tae Kim

Jin-Tae Kim

Jaewan Choi

Byounggon Kang

Dalhee Lee

Jaeha Lee

Panjae Park

Hyoung-Suk Oh

Sung-Wee Cho

Junghwan Shin

Chang-beom Kim

Sutae Kim

Ki-Man Park

Hyun-jeong Roh

Hyun-Jeong Roh

Yongeun Cho

Shigenobu Maeda

Soyoung Lee

SungWon Cho

Yong-ho Kim

Sung Chul Park

Jiyoung Jung

Chul Hong Park

Bonghyun Lee

Jaeseok Yang

Ji-Hyun Lee

Yuichi Hirano

Sung-Hyun Park

Sung Min Kang

Woo-Jin Rim

Yoonho Choi

Changbeom Kim

Subin Jin

Ji Wook Kwon

Chunghee Kim

Hyoung-Min Park

Yoshinao Harada

Sang-Hyun Yoo

Sungkeun Park

Donggyun Kim

Haesun Park

Jae-Gul Choo

Sinwoo Kim

Hye-Jin Kam

Mira Kang

Jeongeuy Park

Jidong Sung

Heeyoung Shin

Soojin Cho

Sang-Jin Cheong

JinTae Kim

Daekwon Kang

Younggook Park

Myungsoo Jang

A semiconductor device includes a flip flop cell. The flip flop cell is formed on a semiconductor substrate, includes a flip flop circuit, and comprises a scan mux circuit, a master latch circuit, a slave latch circuit, a clock driver circuit, and an output circuit. Each of the scan mux circuit, the master latch circuit, the slave latch circuit, the clock driver circuit, and the output circuit includes a plurality of active devices which together output a resulting signal for that circuit based on inputs, is a sub-circuit of the flip flop circuit, and occupies a continuously-bounded area of the flip flop circuit from a plan view. At least a first sub-circuit and a second sub-circuit of the sub-circuits overlap from the plan view in a first overlap region, the first overlap region including part of a first continuously-bounded area for the first sub-circuit and part of a second continuously-bounded area for the second sub-circuit.

Semiconductor device

A semiconductor device includes a substrate including a first active region and a second active region, the first active region having a conductivity type that is different than a conductivity type of the second active region, and the first active region being spaced apart from the second active region in a first direction, gate electrodes extending in the first direction, the gate electrodes intersecting the first active region and the second active region, a first shallow isolation pattern disposed in an upper portion of the first active region, the first shallow isolation pattern extending in the first direction, and a deep isolation pattern disposed in an upper portion of the second active region, the deep isolation pattern extending in the first direction, and the deep isolation pattern dividing the second active region into a first region and a second region.

Disclosed is a semiconductor device comprising a logic cell including first and second active regions spaced apart in a first direction on a substrate, first and second active patterns on the first and second active regions and extend in a second direction, first and second source/drain patterns on the first and second active patterns, gate electrodes extending in the first direction to run across the first and second active patterns and arranged in the second direction at a first pitch, first lines in a first interlayer dielectric layer on the gate electrodes and each electrically connected to the first source/drain pattern, the second source/drain pattern, or the gate electrode, and second lines in a second interlayer dielectric layer on the first interlayer dielectric layer and extending parallel to each other in the first direction.

Disclosed is a semiconductor device comprising a logic cell that is on a substrate and includes first and second active regions spaced apart from each other in a first direction, first and second active patterns that are respectively on the first and second active regions and extend in a second direction intersecting the first direction, gate electrodes extending in the first direction and running across the first and second active patterns, first connection lines that are in a first interlayer dielectric layer on the gate electrodes and extend parallel to each other in the second direction, and second connection lines that are in a second interlayer dielectric layer on the first interlayer dielectric layer and extend parallel to each other in the first direction.

A semiconductor device includes a standard cell, which includes first to fourth active areas that are extended in a first direction, first to fourth gate lines that are extended in a second direction perpendicular to the first direction over the first to fourth active areas and are disposed parallel to each other, a first cutting layer that is disposed between the first active area and the second active area and separates the second and third gate lines, a second cutting layer that is disposed between the third active area and the fourth active area and separates the second and third gate lines, a first gate contact that is formed on the second gate line separated by the first cutting layer and the second cutting layer, and a second gate contact that is formed on the third gate line separated by the first cutting layer and the second cutting layer.

Semiconductor device including standard cell

A scan flip-flop includes an input unit and a flip-flop. The input unit is configured to select one signal from among a data input signal and a scan input signal to supply the selected one signal as an internal signal according to an operation mode. The flip-flop is configured to latch the internal signal according to a clock signal. The flip-flop includes a cross coupled structure that includes first and second tri-state inverters which share a first output node and face each other.

Scan flip-flop and scan test circuit including the same

A standard cell of an IC includes a cell area including a transistor configured to determine a function of the standard cell; a first dummy area and a second dummy area respectively adjacent to two sides of the cell area in a first direction; and an active area extending in the first direction across the cell area, the first dummy area, and the second dummy area. The active area includes a first active area and a second active area spaced apart from each other in a second direction perpendicular to the first direction and extend parallel to each other in the first direction. At least one of the first active area and the second active area provided in the first dummy area is biased, and at least one of the first active area and the second active area provided in the second dummy area is biased.

Integrated circuit including standard cell

Disclosed is a semiconductor device including a substrate with first and second regions adjacent to each other in a first direction, and first to third gate electrodes extending from the first region toward the second region. Each of the first and second regions includes a PMOSFET region and an NMOSFET region. The first to third gate electrodes extend in the first direction and are sequentially arranged in a second direction different from the first direction. The first and third gate electrodes are supplied with a first signal. The second gate electrode is supplied with a second signal that is an inverted signal of the first signal. The first gate electrode includes a first gate of the first region and a first gate of the second region. The first gates are aligned and connected with each other in the first direction.

A system on chip includes first to third nanowires extending in a second direction, first to third gate lines respectively surrounding the first to third nanowires, each of the first to third gate lines extending in a first direction across the second direction, a gate isolation region cutting the first to third gate lines and extending in the second direction, a first gate contact formed on the second gate line arranged between the first gate line and the third gate line, and electrically connecting the cut second gate line, a second gate contact formed on the first gate line, a third gate contact formed on the third gate line, a first metal line electrically connecting the second gate contact and the third gate contact; and a second metal line electrically connected to the first gate contact.

System on chip

An integrated circuit includes a first conductive pattern in a first conductive layer, a second conductive pattern in a second conductive layer over the first conductive layer, and a via electrically connected with the first conductive pattern and the second conductive pattern to allow a first current flowing from the first conductive pattern to the second conductive pattern and a second current flowing from the second conductive pattern to the first conductive pattern to pass through at different times. The via is placed on the first conductive pattern so that a path of the first current does not overlap with a path of the second current in the first conductive pattern.

Integrated circuit including interconnection and method of fabricating the same, the interconnection including a pattern shaped for mitigating electromigration

A method of manufacturing a semiconductor device includes configuring a layout pattern; and forming conductive lines corresponding to the layout pattern on a substrate, wherein configuring the layout pattern includes: arranging pre-conductive patterns and post-conductive patterns for a first logic cell, a second logic cell, and a third logic cell; rearranging the pre-conductive patterns and the post-conductive patterns so that two conductive patterns that are adjacent to a boundary between two adjacent logic cells from among the first logic cell, the second logic cell, and the third logic cell are formed by different photolithography processes; and arranging conductive patterns for a dummy cell arranged between the second logic cell and the third logic cell.

Method for designing layout of semiconductor device and method for manufacturing semiconductor device using the same

A semiconductor device includes first to fourth cells sequentially disposed on a substrate, first to third diffusion break structures, a first fin structure configured to protrude from the substrate, the first fin structure comprising first to fourth fins separated from each other by the first to third diffusion break structures, a second fin structure configured to protrude from the substrate, to be spaced apart from the first fin structure, the second fin structure comprising fifth to eighth fins separated from each other by the first to third diffusion break structures, the first to fourth gate electrodes being disposed in the first to fourth cells, respectively, and the number of fins in one cell of the first to fourth cells is different from the number of fins in an other cell of the first to fourth cells.

A flip-flop includes an input interface, a first latch, a third inverter, and a second latch. The third inverter and the fifth inverter include first transistors of a first type formed between a first power contact and a second power contact supplied with a power supply voltage on first-type fins, and second transistors of a second type formed between a first ground contact and a second ground contact supplied with a ground voltage on second-type fins.

Flip-flop including 3-state inverter

A method of designing a layout of an integrated circuit (IC) includes placing a first cell in the layout, placing a second cell in the layout adjacent to the first cell at a first boundary between the first and second cells, and generating a plurality of commands executable by a processor to form a semiconductor device based on the layout. The first cell includes a first pattern and a second pattern. The first and second patterns are adjacent to the first boundary, the first and second patterns have different colors, and a first boundary space between the first pattern and the first boundary is different from a second boundary space between the second pattern and the first boundary.

Integrated circuit and method of designing layout of integrated circuit

Growing community of inventors

Seoul, South Korea

Ha-Young Kim