Hynix Semiconductor Inc.

Samsung Electronics Co., Ltd.

Skhynix Inc.

Ewha University-Industry Collaboration Foundation

I-Sens, Inc.

Rubetty Inc.

Ha Na Lee

Sung Min Kim

Seong Cheol Kim

Kwon Whan Han

Chang Jun Park

Hyeong Seok Choi

Seung Taek Yang

Jong Hoon Kim

Seung Hyun Lee

Yong Kim

Min Suk Suh

Jin Won Lee

Tac Keun Oh

Sang Joon Lim

Choong Beom You

Hyo Seon Park

Ji Hea Park

Se Jun Song

Sook Kyung Kim

Ji Seon Nah

An apparatus for controlling operations of a continuous glucose monitoring system. When a continuous glucose monitoring system is located within a certain distance from a user terminal, power of a battery is supplied to the continuous glucose monitoring system through a power switch switched on by an enable signal generated by a near field communication module, thereby operating the continuous glucose monitoring system without user intervention. The near field communication module provides connection information to the user terminal, thereby automatically performing a pairing connection with the user terminal using the near field communication module and a bluetooth communication module. When the pairing connection with the user terminal is completed, an enable signal generated by the bluetooth communication module is provided to the power switch, thereby maintaining the pairing connection with the user terminal even when the user terminal is outside of range for near field communication.

Apparatus for controlling operations of continuous glucose monitoring system

A method for providing a mobile coupon in a mobile electronic device is provided. The method includes collecting information about the mobile coupon including a domain to which the mobile coupon is applicable, from a mobile coupon image including the mobile coupon, determining whether the domain to which the mobile coupon is applicable is identical with a domain of a web site accessed by the mobile electronic device and outputting, when the domain to which the mobile coupon is applicable is identical with a domain of a web site accessed by the mobile electronic device, the information about the mobile coupon.

Method for providing mobile coupon and mobile electronic device supporting the same

Tongs for sealing an opening of a bag includes a first body having a first side, a second side and a third side connecting the first and second side, and a second body having a first side, a second side and a third side connecting the first and second side. The first body and the second body are configured to be combined with each other, so that the first body and the second body cover a surface and an opposite surface of the bag configured to cover and seal the opening of the bag.

Tongs for sealing opening of bag

A wafer level chip scale package having an enhanced heat exchange efficiency with an EMF shield is presented. The wafer level chip scale package includes a semiconductor chip, an insulation layer, and a metal plate. The semiconductor chip has a plurality of bonding pads on an upper face thereof. The insulation layer is disposed over the upper face of the semiconductor chip and has openings that expose some portions of the bonding pads. The metal plate covers an upper face of the insulation layer and side faces of the semiconductor chip in which the metal plate is electrically insulated from the bonding pads.

Wafer level chip scale package having an enhanced heat exchange efficiency with an EMF shield and a method for fabricating the same

A semiconductor chip with a chip selection structure suitable for a stacked semiconductor chip includes a semiconductor chip body and a chip selection structure. The chip selection structure includes a chip selection pad disposed over the semiconductor chip body, a main through electrode electrically connected to the chip selection pad, and a sub through electrode interposed between the main through electrode and the chip selection pad. A plurality of the semiconductor chips, each having the same chip selection structure, can be stacked by offsetting the stacked semiconductor chips.

Semiconductor chip with chip selection structure and stacked semiconductor package having the same

A stacked wafer level semiconductor package module includes a semiconductor chip module including first and second semiconductor chips each having a rectangular shape. The first semiconductor chip has first pads disposed along a first short side of a lower surface thereof. The second semiconductor chip has second pads disposed along a first short side of a lower surface thereof. The first and second semiconductor chips are stacked so as to expose the first pad and the second pad on one side of the stacked first and second semiconductor chips. The package also includes a substrate having a first connection pad facing the first pad and a second connection pad facing the second pad. The package also includes a first connection member for connecting the first pad to the first connection pad, and a second connection member for connecting the second pad to the second connection pad.

Multi-layer stacked wafer level semiconductor package module

A method for manufacturing a semiconductor package includes forming a groove in the portion outside of the bonding pad of a semiconductor chip provided with the bonding pad on an upper surface thereof; forming an insulation layer on the side wall of the groove; forming a metal layer over the semiconductor chip so as to fill the groove formed with the insulation layer; etching the metal layer to simultaneously form a through silicon via for filling the groove and a distribution layer for connecting the through silicon via and the bonding pad; and removing a rear surface of the semiconductor chip such that the lower surface of the through silicon via protrudes from the semiconductor chip.

Method for manufacturing semiconductor package

Manufacturing a wafer level stack package includes the steps of back-grinding a lower surface of a wafer including a plurality of first semiconductor chips. A support member is attached to a lower surface of the back-grinded wafer. One or more second semiconductor chips are stacked on the respective first semiconductor chips of the back-grinded wafer. First through-electrodes are formed to electrically connect the stacked first semiconductor chips and second semiconductor chips. Third semiconductor chips are attached to uppermost ones of the stacked second semiconductor chips, and the third semiconductor chips have second through-electrodes which are electrically connected to the first through-electrodes and re-distribution lines which are connected to the second through-electrodes. Outside connection terminals are attached to the re-distribution lines of the third semiconductor chips. The first semiconductor chips of a wafer level on which the second and third semiconductor chips are stacked are sawed to for semiconductor packages at a chip level.

Method for manufacturing stack package using through-electrodes

The present invention provides a novel fluorescent chemosensor including a naphthalene diimide-Zn(II) complex, which can efficiently recognize pyrophosphate (PPi) at pH 7.4. The fluorescent chemosensor exhibits a new kind of excimer fluorescence, which is selective for PPi in 100% aqueous solution. Further, since the naphthalene diimide-Zn(II) complex of the present invention does not couple with inorganic phosphate (Pi) or adenosine triphosphate (ATP) and has high selectivity for PPi, it can be usefully used to detect pyrophosphate (PPi), which serves to transfer signals and store energy in living organisms.

Naphthalene diimide-Zn(II) complex having selectivity for pyrophosphate, preparation method thereof and detecting method of pyrophosphate using the same

A stack package includes a base substrate having connection pads on an upper surface thereof and ball lands on a lower surface thereof; at least two semiconductor chps stacked by intervening a spacer on the base substrate and defined with through-holes for electrical connections on positions corresponding to the connection pads; electrical connection members for electrically connecting the stacked semiconductor chips and the base substrate to each other; a pair of heat sinks formed such that they contact the side surfaces of the stacked semiconductor chips and extend in a direction perpendicular to the base substrate; and outside connection terminals attached to the ball lands located on the lower surface of the base substrate.

Growing community of inventors

Seoul, South Korea

Ha Na Lee