Samsung Electronics Co., Ltd.

Lg Innotek Co., Ltd.

Samsung Sdi Co., Inc.

Egtm Co., Ltd.

Lg Electronics Inc.

Hanall Biopharma Co., Ltd.

Skhynix Inc.

Ha Na Kim

Byung Mok Kim

Hiroshi Kodaira

Yuichiro Tanda

Satoshi Ozeki

Sung Ho Lee

Jong Chull Shon

Bo Hee Kang

Baek Jun Kim

Myung Sup Jung

Yong Joo Lee

Deuk Kyu Moon

Eun Sun Kim

Jung Woo Lee

Jong Hoon Won

Sung Wuk Kim

Jae Min Kim

Sung Soo Jun

Seung Kook Park

Jae Kap Jeong

Yeon Jung Song

Min Gyu Jung

Song Young Kim

Woong Jin Choi

Geun Su Lee

Sang Ho Park

Min Jae Lee

Dai Hyung Ryu

Sung Ha Park

Beom Seok Lee

Kui Hyun Kim

Sang Bum Park

Joo Hee Park

Euy Hyun Cho

Ho Young Joo

Ju Hwan Jeong

Hyeon Sik Cho

Sang Ung Hwang

Beom Seok Kim

Woong Il Choi

Ji Yeon Kim

Dong Hyun Lee

Hyun Don Song

Jun Yong Park

Gang Ho Woo

Hyun Yong Choi

Boreum Jeong

Jung Hun Oh

Kyung Hoon Song

Hae Jin Park

Ki Man Kang

Eun Ae Jung

Yong Hyun Kwon

Dae Hyun Jang

Gyu Sung Do

Ja Young Hwang

Seung Jae Jung

Gun Young Heo

Soon Young Kwon

Ji Yeon Han

Sun Young Baik

Young Woo Park

Hyun Joo Seo

Myung Soo Lee

Hyeon Sun Choi

Tae-Rae Kim

Ji Won Moon

Hyun Sik Noh

Youn Jo Ko

Nam Hyo Kim

Byung Min Lee

Myung Kook Park

You Na Choo

Jee Hoon Park

Soo Hyun Whang

Dong Hak Jang

Myeong Il Kim

Han Bin Lee

Kyu Ho Cho

Sang Joon Yoon

Kyung Mi Song

Provided is a method for areal selective forming of a thin film according to an exemplary embodiment of the present disclosure including: a substrate preparation step of supplying and stabilizing a substrate including a growth area and a non-growth area into a chamber; a precursor supply step of supplying a metal precursor compound into the chamber and adsorbing the metal precursor compound to the substrate; a purge step of purging the inside of the chamber; and a thin film formation step of supplying a reaction material into the chamber to react with the metal precursor compound and form a thin film, in which the metal precursor compound is a Group 5 metal precursor compound represented by Chemical Formula 1 below:

Method for areal selective forming of thin film

Disclosed is a method of forming an area-selective thin film, the method comprising supplying a nuclear growth retardant to the inside of the chamber in which the substrate is placed, so that the nuclear growth retardant is adsorbed to a non-growth region of the substrate; purging the interior of the chamber; supplying a precursor to the inside of the chamber, so that the precursor is adsorbed to a growth region of the substrate; purging the interior of the chamber; and supplying a reaction material to the inside of the chamber, so that the reaction material reacts with the adsorbed precursor to form the thin film.

Area-selective method for forming thin film by using nuclear growth retardation

According to one embodiment of the present invention, a method for forming a thin film using a surface protection material comprises: a surface protection layer forming step of forming a surface protection layer on the surface of a substrate by supplying a surface protection material to the inside of a chamber in which the substrate is placed; a step of performing a primary purging of the inside of the chamber; a metal precursor supply step of supplying a metal precursor to the inside of the chamber; a step of performing a secondary purging of the inside of the chamber; and a thin film forming step of supplying a reactive material to the inside of the chamber so as to react with the metal precursor and form a thin film.

Method for forming thin film using surface protection material

Disclosed is a method of forming a thin film using a surface protection material, the method comprising supplying the surface protection material to the inside of a chamber on which a substrate is placed so that the surface protection material is adsorbed to the substrate, discharging the unadsorbed surface protection material from the inside of the chamber by purging the interior of the chamber, supplying a metal precursor to the inside of the chamber so that the metal precursor is adsorbed to the substrate, discharging the unadsorbed metal precursor from the inside of the chamber by purging the interior of the chamber, and supplying a reaction material to the inside of the chamber so that the reaction material reacts with the adsorbed metal precursor to form the thin film.

Method of forming a thin film using a surface protection material

A light-emitting device package according to an embodiment includes a package body including a cavity and a recessed portion formed around the cavity, the recessed portion having at least one concave portion; at least one light-emitting device mounted in the cavity; a light-transmitting member disposed to cover a top of the cavity and configured to transmit light emitted from the at least one light-emitting device; and a bonding member accommodated in the at least one concave portion so as to allow the light-transmitting member and the package body to be bonded to each other in the recessed portion.

Light-emitting device package having a device to prevent permeation of foreign substances

The present invention relates to a separator comprising a coating layer and a battery using the same, the separator having improved adhesive force to an electrode, thereby minimizing the rate of thickness change. More specifically, the present invention relates to a separator having a coating layer on one or both surfaces of a base film, the coating layer comprising an acrylic-based copolymer having a glass transition temperature of less than or equal to 80&#xb0; C. and an inorganic particle, so as to have improved adhesive force and heat resistance, thereby being applicable in electrochemical batteries of various sizes and having excellent thermal stability and dimensional stability.

Separator comprising coating layer, and battery using same

A display apparatus is provided. The display apparatus includes a display panel that displays an image in a forward direction thereof; a bezel disposed on an edge of the display panel; and a light refraction member disposed in front of the bezel, the light refraction member including a transparent material, and refracting light of an outer rear side of the bezel in a forward direction of the bezel.

Display apparatus

A light-emitting device package of the embodiments includes a package body; at least one light emitting device above the package body; an adhesive layer between the at least one light emitting device and the package body; and an adhesive-layer-accommodating portion disposed in the package body for accommodating the adhesive layer therein, wherein the adhesive-layer-accommodating portion has a side surface disposed to be inclined at a predetermined angle relative to an imaginary vertical plane that extends in a thickness direction of the package body.

Light-emitting device package

An anisotropic conductive film composition, an anisotropic conductive film prepared using the same, and a connection structure using the same, the anisotropic conductive film including a binder resin; a curable alicyclic epoxy compound; a curable oxetane compound; a quaternary ammonium catalyst; and conductive particles, wherein the anisotropic conductive film has a heat quantity variation rate of about 15% or less, as measured by differential scanning calorimetry (DSC) and calculated by Equation 1:Heat quantity variation rate (%)=[()/]&#xd7;100&#x2003;&#x2003;Equation 1

Composition for anisotropic conductive film, anisotropic conductive film, and connection structure using the same

A sample test method, microfluidic device, and test device efficiently and accurately compensates for interference of an interfering substance present in a sample using optical measurement without addition of a separate reagent for detecting the interfering substance. The sample test method includes: measuring an optical characteristic value of a target substance present in a sample; measuring an optical characteristic value of an interfering substance present in the sample; and determining a concentration of the target substance for which interference of the interfering substance is compensated for based on the optical characteristic value of the interfering substance.

Sample test method, microfluidic device, and test device

A method of manufacturing a semiconductor device includes alternately stacking mold insulating layers and sacrificial layers on a substrate; forming channel holes penetrating through the mold insulating layers and the sacrificial layers and allowing recessed regions to be formed in the substrate; cleaning a surface of the recessed regions in such a manner that processes of forming a first protective layer in an upper region of the channel holes and performing an anisotropic dry etching process on the recessed regions in a lower portion of the channel holes are alternately repeated one or more times, in-situ; and forming epitaxial layers on the recessed regions of the substrate.

Method of manufacturing semiconductor devices

A composition for a polarizing film including a polymer and at least one of dichroic dye, wherein the dichroic dye includes a first dichroic dye represented by Chemical Formula 1 and having a molecular weight of greater than or equal to about 500 Daltons: wherein in Chemical Formula 1, Arto Ar, R, R, n, and m are the same as described in the detailed description.

Composition for polarizing film, polarizing film, and display device

A light emitting device package is disclosed. The light emitting device package includes a package body including at least one ceramic layer, a submount disposed at the package body, a light emitting device disposed on the submount for emitting ultraviolet (UV)-wavelength light, and an anti-reflection (AR) coating layer disposed around the light emitting device, the AR coating layer being formed of an inorganic coating layer.

Light emitting device package

An induction heating cooker including a temperature sensor disposed between a plurality of working coils which are uniformly disposed below a cooking table and a heat transfer member to transfer heat from the working coils adjacent to the temperature sensor to the temperature sensor, thereby improving productivity and space utilization.

Temperature sensor and induction heating cooker having the same

Growing community of inventors

Seoul, South Korea

Ha Na Kim