Samsung Electronics Co., Ltd.

Ha-Jin Kim

Dong-earn Kim

Sang-Eui Lee

In-Taek Han

Min-jong Bae

Yoon-chul Son

Dong-ouk Kim

Sung-hoon Park

Kun-mo Chu

Sang-Soo Jee

Sang Heon Lee

Young-chul Ko

Young-Chul Ko

Nak-Hyun Kim

Woo-Taek Hwang

Dong-Earn Kim

Min-Jong Bae

Kun-Mo Chu

Yoon-Chul Son

A super-hydrorepellent coating composition including a nano structure, polyorganosiloxane, a cross-linker, and a catalyst; a super-hydrorepellent coating layer including a cured product of the super-hydrorepellent coating composition; and a heat exchanger including the super-hydrorepellent coating layer.

Super-hydrorepellent coating composition, super-hydrorepellent coating layer including cured product of the super-hydrorepellent coating composition, and heat exchanger including the super-hydrorepellent coating layer

A resistance heating composition including a silicon emulsion particle, a carbon nanotube, and an aqueous medium.

Resistance heating composition, heating composite using the composition, method of preparing the heating composite, and heating apparatus and fusing apparatus using the same

A resistance heating element includes a positive temperature coefficient resistance heating layer having a positive temperature coefficient, and a negative temperature coefficient resistance heating layer, which is connected to the positive temperature coefficient resistance heating layer and has a negative temperature coefficient.

Resistance heating element and heating member and fusing device employing the same

A heating member includes: a resistive heating layer which generates heat when supplied with electrical energy; a release layer as an outermost layer of the heating member and including a polymer; an intermediate layer disposed between the resistive heating layer and the release layer. The resistive heating layer includes a base polymer, and an electroconductive filler dispersed in the base polymer. The intermediate layer includes a polymer material being a same type as the base polymer of the resistive heating layer or the polymer of the release layer.

Heating member including a base polymer and fusing apparatus including the same

A method of forming a thin film resistive heating layer, the method including: forming a polymer layer by extruding a polymer paste, in which an electrically conductive filler is dispersed, by using an extrusion molding operation, on an outer circumferential surface of a cylindrical member; and forming a thin film resistive heating layer by making an outer diameter of the polymer layer uniform by using a ring blading operation.

Method of forming thin resistive heating layer, heating member including the thin resistive heating layer, and fusing unit including the heating member

A heating member includes a resistive heating layer disposed on an outermost layer of the heating member, where the resistive heating layer includes a conductive filler distributed in a base material and where the resistive heating layer emits heat when supplied with an electric current from an electrode, and a contacting unit which exposes the conductive filler of the resistive heating layer and contacts the electrode.

Heating member including resistive heating layer, and fusing apparatus and image forming apparatus including the heating member

A fusing device includes; a heating member having a resistive heating layer constituting an outermost portion of the heating member, a nip forming member facing the heating member to form a fusing nip therewith, and a plurality of current supplying electrodes which contact an outer circumference of the resistive heating layer to supply electrical current to the resistive heating layer.

Growing community of inventors

Hwaseong-si, South Korea

Ha-Jin Kim