Samsung Electro-mechanics Co., Ltd.

Ha Jeong Kim

Myung Jun Park

Eui Hyun Jo

Jun Hyeong Kim

Hyun Hee Gu

Byung Jun Jeon

Chul Seung Lee

Woo Kyung Sung

Jin Soo Park

Kangha Lee

Kyu Sik Park

Eun Me Park

Jin Yeop Yoo

Jong Ryeong Kim

A multilayer electronic component includes a body including a dielectric layer and internal electrodes stacked in a first direction with the dielectric layer interposed therebetween and external electrodes including a first electrode layer connected to the internal electrodes and including Ni, and a second electrode layer disposed on the first electrode layer and including an Ni—Cu alloy. A Cu content of the second electrode layer is 70 mol to 90 mol compared to 100 mol of the total content of Ni and Cu of the second electrode layer.

Multilayer electronic component

A multilayer electronic component includes: a body having first and second surfaces opposing each other in a first direction and third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction; a first external electrode including a first connection portion, disposed on the third surface, and a first band portion extending from the first connection portion onto a portion of the first surface; a second external electrode including a second connection portion, disposed on the fourth surface, and a second band portion extending from the second connection portion onto a portion of the first surface; an insulating layer disposed on the second surface to extend to portions of the first and second connection portions; a first plating layer disposed on the first band portion; and a second plating layer disposed on the second band portion. The insulating layer includes a polymer resin.

A multilayer electronic component includes: a body including dielectric layers and first and second internal electrodes alternately disposed with the dielectric layers respectively interposed therebetween, the first internal electrodes being exposed to two end surfaces of the body, the second internal electrodes being exposed to a mounting surface of the body perpendicular to the end surfaces; a pair of connection portions each including a conductive layer disposed on one of the end surfaces of the body and connected to the first internal electrodes and an insulating layer disposed on the conductive layer; first and second external electrodes disposed on the mounting surface of the body and connected to the conductive layers of the pair of connection portions, respectively; and a third external electrode disposed between the first and second external electrodes on the mounting surface of the body and connected to the second internal electrodes.

Multilayer electronic component having improved electrode structure for increased capacity per unit volume

Growing community of inventors

Suwon-si, South Korea

Ha Jeong Kim