Samsung Electro-mechanics Co., Ltd.

Ha Il Kim

Yang Je Lee

Dong Gi An

Going Sik Kim

Il Woon Shin

Doo Pyo Hong

Jae Ho Shin

Jung Soo Kim

Dek Gin Yang

Jong Hyung Kim

Seok Jun Ahn

Young Man Kim

Soo Ah Lee

Su Hyun Park

Kyung Chul Yu

A printed circuit board includes an internal insulating layer, an internal conductive pattern layer disposed on the internal insulating layer and including a line portion and a bonding pad portion, and an external insulating layer disposed on the internal conductive pattern layer and the internal insulating layer and having an accommodation groove extending therethrough to expose the bonding pad portion. The bonding pad portion includes a connection pattern extending from the line portion of the internal conductive pattern layer embedded in the external insulating layer, and exposed to the accommodation groove; a land pattern disposed closer to a center portion of the accommodation groove than the connection pattern; and a dam pattern connecting the connection pattern and the land pattern, in which a line width of the dam pattern is narrower than a line width of the land pattern.

Printed circuit board

The present invention relates to a method of manufacturing a flying tail type rigid-flexible printed circuit board and a flying tail type rigid-flexible printed circuit board manufactured by the same and implement a flying tail type rigid-flexible printed circuit board with improved filling property by providing a method of manufacturing a flying tail type rigid-flexible printed circuit board including: providing a base substrate having a first inner circuit pattern layer on both surfaces; laminating a first insulating layer on a rigid domain R of the base substrate; laminating at least one circuit layer, which extends over the entire domain of the base substrate, on the first insulating layer; and removing a portion of the circuit layer, which corresponds to a flexible domain F, wherein the circuit layer includes a second insulating layer and a flying tail type rigid-flexible printed circuit board manufactured by the same.

Flying tail type rigid-flexible printed circuit board

There are provided a rigid flexible printed circuit board and a method of manufacturing the same. The rigid flexible printed circuit board according to an exemplary embodiment of the present disclosure includes: a flexible board including a flexible region, a first rigid region formed at one side of the flexible region, and a second rigid region formed at the other side of the flexible region; a first rigid board formed on the flexible board and formed in the first rigid region and the second rigid region; and a second rigid board formed below the flexible board and formed in the first rigid region.

Rigid flexible printed circuit board and method of manufacturing the same

A method of manufacturing a rigid-flexible printed circuit board includes providing a base substrate in which coverlays are respectively formed on two sides of a flexible copper foil laminate on both sides of which inner circuit patterns and a first window are respectively formed; layering insulation layers and copper foil layers on portions of coverlays which are to be a rigid region of the base substrate; forming a via hole in the rigid region, and, simultaneously, forming a via hole to correspond to the first window in a flexible region; forming outer circuit patterns including areas adjacent to the first window; and applying solder resists in the rigid region to expose portions of external circuit patterns. The region adjacent to the via holes in the flexible region includes additional plating portions for covering the coverlays.

Method of manufacturing a rigid-flexible printed circuit board

A method of manufacturing a rigid-flexible printed circuit board, including providing a base substrate in which coverlays are respectively formed on two sides of a flexible copper foil laminate on both sides of which inner circuit patterns are respectively formed; layering insulation layers and copper foil layers on portions of coverlays which are to be a rigid region of the flexible copper foil laminate; forming a via hole in the rigid region, and, simultaneously, forming first windows in the coverlays in a flexible region; forming outer circuit patterns including areas adjacent to the first windows; and applying solder resist in the rigid region to expose portions of the external circuit patterns, where the outer circuit patterns formed in the areas adjacent to the first windows include additional plating portions for covering portions of the coverlays.

Method of manufacturing rigid-flexible printed circuit board

Growing community of inventors

Seoul, South Korea

Ha Il Kim