Applied Materials, Inc.

H Peter W Hey

Yezdi N Dordi

Donald J K Olgado

Joseph Stevens

Mark Robert Denome

Mehul B Naik

Suketu Arun Parikh

Michael N Sugarman

Samuel Broydo

An apparatus comprising an electrolyte cell, an anode, and a porous rigid diffuser. The electrolyte cell is configured to receive a substrate to have a metal film deposited thereon. An anode is contained within the electrolyte cell. A porous rigid diffuser is connected to the electrolyte cell and extends across the electrolyte cell. The diffuser is positioned between a location that the substrate is to be positioned when the metal film is deposited thereon and the anode.

Flow diffuser to be used in electro-chemical plating system

A method for depositing a metal on a substrate is provided. The metal is deposited by sequentially applying a electrodeposition pulse followed by an electrodissolution pulse to the substrate. After each electrodissolution pulse an before the next electrodeposition pulse there is provided at least one time interval of zero electrical voltage or current, also known as an 'off-time', between the pulses. The first two electrodeposition pulses should preferably have the same time durations. Thereafter, the time durations of subsequent electrodeposition pulses are gradually decreased to provide a void-free and seam-free deposition of metal in high aspect ratio features.

Dynamic pulse plating for high aspect ratio features

A method and associated apparatus for electro-chemically depositing a metal film on a substrate having a metal seed layer. The apparatus comprises a substrate holder that holds the substrate. The electrolyte cell receives the substrate in a processing position. The actuator is connected to the substrate holder and adjustably positions the substrate relative to the electrolyte cell. The method involves electro-chemically depositing a metal film on a substrate having a metal seed layer comprising disposing the substrate in an electrolyte cell that is configured to receive the substrate. The method comprises adjustably positioning the substrate relative to the electrolyte cell.

Deposition uniformity control for electroplating apparatus, and associated method

Flow diffuser to be used in electro-chemical plating system and method

A method of immersing a substrate into electrolyte solution for electroplating, the method comprising connecting an electric source between an anode immersed in the electrolyte solution and a seed layer formed on the substrate. A first voltage level of the seed layer is biased to be equal to, or more positive than, a second voltage level of the anode. The substrate is then immersed into the electrolyte solution.

Reverse voltage bias for electro-chemical plating system and method

A method and apparatus for processing a substrate is described. In one aspect, a processing system is provided which includes a wet area and a dry area. In another aspect, a method comprises processing the substrate in the process cell. The substrate is transferred from the process cell to a dry module and then transferring the substrate to a drying area.

Segmenting of processing system into wet and dry areas

The present invention provides integrated circuit fabrication methods and devices wherein dual damascene structures ( and ) are formed in consecutive dielectric layers ( and ) having dissimilar etching characteristics. The present invention also provides for such methods and devices wherein these dielectric layers have different dielectric constants. Additional embodiments of the present invention include the use of single layer masks, such as silicon-based photosensitive materials which form a hard mask ( ) upon exposure to radiation. In additional embodiments, manufacturing systems ( ) are provided for fabricating IC structures. These systems include a controller ( ) which is adapted for interacting with a plurality of fabrication stations ( and ).

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Sunnyvale, CA, United States of America

H Peter W Hey