Stats Chippac Pte. Ltd.

Gyung Sik Yun

Hye Ran Lee

Tae Kyu Choi

DongWon Son

BongHwan Han

SeungJoo Kwak

Sang Ha Hwang

A method of manufacture of an integrated circuit packaging system includes: providing a package carrier having a carrier top side; mounting an integrated circuit over the carrier top side; attaching a bottom attachment directly on the integrated circuit; dragging a sandwich connector from the bottom attachment, the sandwich connector having a connector diameter; and attaching a top attachment directly on the sandwich connector, the top attachment wider than the bottom attachment.

Integrated circuit packaging system with interconnects and method of manufacture thereof

An integrated circuit package system includes: connecting a first interconnect between a carrier and a bottom integrated circuit thereover; forming a film, having an overhang portion, over the bottom integrated circuit with the overhang portion over the first interconnect; mounting a top integrated circuit over the film; connecting a second interconnect between the top integrated circuit and the carrier with the overhang portion between the first interconnect and the second interconnect; and forming an encapsulation over the carrier covering the top integrated circuit, the film, the first interconnect, and the second interconnect.

Integrated circuit package system with overhang film

Growing community of inventors

Youngin, South Korea

Gyung Sik Yun