Electronics and Telecommunications Research Institute

Gyung Ock Kim

Dong Wan Roh

Sang Hoon Kim

Woo Jin Lee

In Kui Cho

Su Hwan Oh

Sun Jin Yun

Sung Bock Kim

Jiho Joo

Kwang Ryong Oh

In Gyoo Kim

Yong Soon Baek

Jaegyu Park

Kwang Yong Kang

Byung Gyu Chae

Seung Ho Ahn

Hyun Tak Kim

Kwang Eui Pyun

Moon Ho Park

Dong Woo Suh

Sang Pil Han

In Kyu Kim

Sahng Gi Park

Hee Kyung Sung

Bong Jun Kim

Ji Ho Joo

Yong Wook Lee

A 3D optical switch for transferring an optical signal between a plurality of layers of an optical integrated circuit, which comprises: a first optical coupler for distributing the optical signal input to a first optical waveguide deployed in a first layer among the plurality of layers to a second optical waveguide deployed in a second layer different from the first layer; a phase shifter for changing a phase of a first optical signal in the first optical waveguide passing through the first optical coupler and a phase of a second optical signal in the second optical waveguide distributed by the first optical coupler; and a second optical coupler for combining the first optical signal of which the phase is changed and the second optical signal of which the phase is changed is provided.

Three-dimensional optical switch

A method of growing a germanium (Ge) epitaxial thin film having negative photoconductance characteristics and a photodiode using the same are provided. The method of growing the germanium (Ge) epitaxial thin film includes growing a germanium (Ge) thin film on a silicon substrate at a low temperature, raising the temperature to grow the germanium (Ge) thin film, and growing the germanium (Ge) thin film at a high temperature, wherein each stage of growth is performed using reduced pressure chemical vapor deposition (RPCVD). The three-stage growth method enables formation of a germanium (Ge) epitaxial thin film characterized by alleviated stress on a substrate, a lowered penetrating dislocation density, and reduced surface roughness.

Growth of germanium epitaxial thin film with negative photoconductance characteristics and photodiode using the same

Provided are an abrupt metal-insulator transition (MIT) device for bypassing super-high voltage noise to protect an electric and/or electronic system, such as, a high-voltage switch, from a super-high voltage, a high-voltage noise removing circuit for bypassing the super-high voltage noise using the abrupt MIT device, and an electric and/or electronic system including the high-voltage noise removing circuit. The abrupt MIT device includes a substrate, a first abrupt MIT structure, and a second abrupt MIT structure. The first and second abrupt MIT structures are formed on an upper surface and a lower surface, respectively, of the substrate. The high-voltage noise removing circuit includes an abrupt MIT device chain connected in parallel to the electric and/or electronic system to be protected. The abrupt MIT device chain includes at least two abrupt MIT devices serially connected to each other.

Abrupt metal-insulator transition device, circuit for removing high-voltage noise using the abrupt metal-insulator transition device, and electrical and/or electronic system comprising the circuit

Provided are a method and structure for optical connection between an optical transmitter and an optical receiver. The method includes the steps of: forming on a substrate a light source device, an optical detection device, an optical transmission unit electrically connected with the light source device, and an optical detection unit electrically connected with the optical detection device; preparing a flexible optical transmission-connection medium to optically connect the light source device with the optical detection device; cutting the prepared optical transmission-connection medium and surface-finishing it; and connecting one end of the surface-finished optical transmission-connection medium with the light source device and the other end with the optical detection device. Fabrication of an optical package having a 3-dimensional structure is facilitated and fabrication time is reduced, thus improving productivity. In addition, since the optical transmission-connection medium is directly connected with the light source device and the optical detection device, a polishing operation or additional connection block is not required, thus facilitating mass production.

Structure and method for optical connection between optical transmitter and optical receiver

Provided is a method of fabricating a semiconductor optical device for use in a subscriber or a wavelength division multiplexing (WDM) optical communication system, in which a laser diode (LD) and a semiconductor optical amplifier (SOA) are integrated in a single active layer. The laser diode (LD) and the semiconductor optical amplifier (SOA) are optically connected to each other, and electrically insulated from each other by ion injection, whereby light generated from the LD is amplified by the SOA to provide low oscillation start current and high intensity of output light when current is individually injected through each electrode.

Method of fabricating semiconductor optical device

Provided is a light coupling apparatus that forms an etch structure complex comprising a total reflection surface/an anti-reflection surface within a substrate to improve coupling efficiency with incident light and responsivity of a photodetector device, whereby a surface-illuminated photodetector or an edge-coupled photodetector are all integratable, and it is possible to reduce the degree of difficulty during packaging and to improve the responsivity of the photodetector at low costs.

Photodetector integratable light coupling apparatus

There is disclosed a photodetector having two or more avalanche-gain layered structures and multi-terminals. The avalanche photodetector includes an emitter light absorption layer structure located between a collector layer and an emitter layer (top contact layer) stacked on a substrate. The photodetector further comprises multiple avalanche-gain layered structures consisting of a charge layer, a multiplication layer and a contact layer between the light absorption layer and said collector layer.

Avalanche photodetector

The present invention is related to a hot-electron photo transistor. By applying the combination of quantum dots or quantum wires with sizes, the wide spacer layers, and the blocking layers to the electron injecting barrier of the emitter, the wide range of infrared detection can be attained and the resolution of detected infrared wavelength can be increased. And by introducing the resonant tunneling quantum well structure to the base layer the selection, amplification and processing of the specific infrared frequency is possible and the reduction of the dark current is induced. Therefore, the present invention is applicable to ultra-high speed tunable infrared detectors and amplifiers, ultra-high speed switching and logic devices, high speed infrared logic devices with new features, new high-speed infrared logic devices which can reduce the number of logic devices.

Hot-electron photo transistor

The present invention is to solve the problems caused in various methods used to improve the performance of the device by improvement of conventional base layer. The present invention discloses a hot electron device which can improve the performance of the device such as the improvement in the current density and decrease in transition time by reducing the dispersion phenomenon by introducing indium arsenide layer having v-shape conduction band due to the graded composition as the base layer of hetero structure hot electron device (HET). In addition, the present invention discloses a resonant tunneling hot electron device which is constructed by adding an emitter electron projection layer to the hot electron device of the present invention so that the Fermi energy and alignment can occur due to the stark shift and the projection of hot electron to the base region can occur through the Fermi energy and alignment.

Hot electron device and a resonant tunneling hot electron device

The present invention relates to an ultra-high speed semiconductor phototransistor which comprises a substrate. A conductive collector layer, on which a collector electrode is formed, is formed on the substrate. A collector barrier layer for collector electric potential is formed on the conductive collector layer. A conductive base layer, on which a base electrode is formed, is formed on the collector electric potential barrier layer. An emitter barrier layer for emitter electric potential is formed on the conductive base layer for injecting hot-electrons onto the conductive base layer. The emitter barrier layer for emitter electric potential further comprises various sizes of quantum-dot array combination structures for absorbing an infrared ray. A blocking barrier layer positioned beneath the quantum-dot array combination structures reduces a dark current passed through the quantum-dot array combination structure. A second buffer layer positioned beneath the blocking barrier layer absorbs an electric potential change in the quantum-dot array combination structure due to the applied voltage. A conductive emitter layer, on which an emitter electrode is formed, is formed on the emitter barrier layer for emitter electric potential.

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Seoul, South Korea

Gyung Ock Kim