Samsung Electronics Co., Ltd.

Gyun Heo

Soonmin Hong

Kyungwoon Jang

Changjoon Lee

Tackmo Lee

Youngjun Moon

Sangmin Shin

Youngki Jung

Changkyu Chung

Dongmyung Son

Seongphil Cho

Daesuck Hwang

Young Jun Moon

Jeonggen Yoon

Wonsoon Park

Gyuhwa Kim

Jinho Kim

Min Cheol Park

Byounguk Yoon

Won Suk Choi

Jinwoo Jung

Dong-Il Son

Hosuk Kang

Tae Sang Park

Song Hee Jung

Sang Jin Hong

Jin-Ho Lim

Taesang Park

Youngchul Lee

Kyung Woon Jang

Soon Min Hong

Hyun Joo Han

Kyoree Lee

Sangyong Eom

Dong Seok Baek

Ja Myeong Koo

Soon-min Hong

Yong-Hwa Kim

Kwangrae Jo

Koang-soo Kim

Sun Gu Yi

Jeongyun Kim

Provided is a display module including a glass substrate, a thin film transistor (TFT) layer provided on a front surface of the glass substrate, a driving circuit provided on a rear surface of the glass substrate and configured to drive the TFT layer, a plurality of light emitting diodes (LED) electrically connected to the TFT layer, a plurality of first connection pads provided at intervals in a portion of the front surface of the glass substrate and electrically connected to a TFT circuit provided in in the TFT layer, a plurality of second connection pads provided at intervals in a portion of the rear surface of the glass substrate and electrically connected to the driving circuit, and a plurality of side wirings extending from the lateral surface of the glass substrate to a portion of an insulating layer and extending to another portion of the insulating layer.

Display module having glass substrate formed with side wirings and method for manufacturing same

A display module and a display apparatus including the same are provided. The display module includes a first substrate; a plurality of micro-pixel controllers provided on an upper surface of the first substrate and including a second substrate; a plurality of pixels including a plurality of inorganic light emitting diodes (LEDs) provided on an upper surface of the second substrate; and a driver integrated chip (IC) configured to transmit a driving signal to the plurality of micro-pixel controllers, wherein each pixel of the plurality of pixels includes at least two inorganic LEDs among the plurality of inorganic LEDs, and wherein each micro-pixel controller of the plurality of micro-pixel controllers is electrically connected to inorganic LEDs of at least two pixels.

Display module, display apparatus and method for manufacturing the same

A display module, including a plurality of pixels, includes: a first substrate; a plurality of micro pixel packages provided on an upper surface of the first substrate; and a driver integrated circuit (IC) configured to transmit a driving signal to the plurality of micro pixel packages. Each of the plurality of micro pixel packages includes a second substrate; a plurality of inorganic light emitting devices provided on an upper surface of the second substrate; and a micro pixel controller provided on a lower surface of the second substrate, the micro pixel controller being configured to control the plurality of inorganic light emitting devices.

Display module

A display panel is disclosed. The disclosed display panel includes a thin film transistor substrate, a plurality of micro LEDs arranged on one surface of the thin film transistor substrate, a plurality of first connection pads disposed on the one surface of the thin film transistor substrate, a plurality of second connection pads disposed on the other surface of the thin film transistor substrate that faces the one surface, and a plurality of connection wirings disposed on a side surface of the thin film transistor substrate for electrically connecting each of the plurality of first connection pads and the plurality of second connection pads, wherein at least one of an edge region on the one surface and an edge region on the other surface of the thin film transistor substrate includes a cutting area which is cut in an inward direction of the thin film transistor substrate.

Display panel

A display panel is provided. The display panel according to an embodiment includes a thin film transistor glass substrate, a plurality of micro light emitting diodes (LEDs) arranged on one surface of the thin film transistor glass substrate, and a plurality of side wirings formed at an edge of the thin film transistor glass substrate to electrically connect the one surface of the thin film transistor glass substrate to an opposite surface to the one surface.

Display panel and large format display apparatus using the same

The disclosure describes a micro Light Emitting Diode (LED) display. The display may include a Printed Circuit Board (PCB) including a plurality of solder pads, a micro LED package including a plurality of micro LED chips, and a plurality of solder electrodes which bond the micro LED chips onto the solder pads of the PCB. The micro LED package may be re-arranged in an Red Green Blue (RGB) state on a temporary fixing film by using a pickup device in accordance with a display pixel configuration, after the micro LED chips are attached to a carrier film.

Micro-LED display and manufacturing method therefor

A display module includes a glass substrate having a front surface and a back surface opposite to the front surface; a TFT layer; LEDs mounted on the TFT layer; and a plurality of side wirings formed at intervals in an edge area of the glass substrate, and the edge area includes a first area corresponding to a side surface of the glass substrate, a second area adjacent to the side surface, and a third area adjacent to the side surface, and a first chamfered surface formed by chamfering a corner at which the first area and the second area meet, and a second chamfered surface formed by chamfering a corner at which the first area and the third area meet, and each of the plurality of side wirings is disposed along the second area, the first chamfered surface, the first area, the second chamfered surface, and the third area.

Display module having glass substrate on which side wirings are formed and manufacturing method of the same

A display module, a display apparatus including a display module, and a method of manufacturing a display module are provided. The method of manufacturing a display module includes forming a non-conductive layer that includes a fluxing function on a substrate, providing a plurality of light-emitting diodes (LEDs) on the substrate, wherein each LED of the plurality of LEDs has a first electrode pad and a second electrode pad spaced apart by a predetermined interval, and the substrate has a plurality of connection pads that are configured to electrically connect to the first electrode pads and the second electrode pads; thermally compressing the plurality of LEDs; and electrically connecting the plurality of LEDs and the substrate via a plurality of soldering members that are provided on at least one of the plurality of LEDs or the substrate.

Display module, display apparatus including the same and method of manufacturing display module

An electronic device and its operating method are provided. The electronic device includes a housing including a first surface, a second surface facing the first surface in a spaced apart manner, and a lateral surface surrounding a space between the first surface and the second surface, a display mounted to the housing and including a flat area substantially corresponding to the first surface and a bending area extended from the flat area in a direction of the lateral surface, a filler disposed between the housing and the bending area of the display, at least one electronic component which is installed to the filler and of which one part is exposed to the outside by penetrating at least one region of the bending area of the display, a detection circuit disposed inside the housing and electrically connected to the electronic component to detect an operation of the electronic component, and at least one processor operatively coupled to the detection circuit and the display to provide control to perform a corresponding function of the electronic device on the basis of a provided detection signal.

Electronic device including component mounting structure through bended display

Disclosed herein is a case structure of an electronic product to which a film-type electronic circuit is adhered. The case structure may include a case of an electronic product and a first film adhered to the case. The case structure may further include a second film adhered to the first film such that one surface of the second film contacts the first film, and an electronic circuit layer adhered to the first film. The electronic circuit layer may be arranged between the first film and the second film, wherein the first film is thermally adhered to the case. The first film may have a melting at a melting point that is lower than a heat-resistant temperature of the case.

Case structure having film type electronic circuit and method of manufacturing the same

Disclosed herein is a method for fabricating a printed circuit board assembly by adhering an element to a printed circuit board without using any solder. The printed circuit board may be fabricated by sequentially applying a conductor-containing first ink and an insulator-containing second ink onto a base substrate by ink-jet printing to form a printed circuit board, mounting an element on the printed circuit board such that an electrode of the element contacts a conductive layer and curing the conductive layer at a high temperature.

Method of fabricating printed circuit board assembly

A zoom switch assembly for an image photographing apparatus includes a fixing member which includes a flat unit, a rotating member which is mounted rotatably with respect to the fixing member, an electric conductivity unit which is mounted on the rotating member to rotate opposite the flat member, and a position detection pattern which is formed along a rotation trace of the electric conductivity unit on the flat unit of the fixing member, and through which electricity flows selectively according to a rotation angle of the electric conductivity unit.

Zoom switch assembly, image photographing apparatus having the same, and method of controlling zoom lens

Growing community of inventors

Suwon-si, South Korea

Gyun Heo