Samsung Electronics Co., Ltd.

Adeka Corporation

Gyuhee Park

Younjoung Cho

Seungmin Ryu

Takanori Koide

Yutaro Aoki

Hiroyuki Uchiuzou

Kazuki Harano

Wakana Fuse

Younsoo Kim

Haruyoshi Sato

Kazuya Saito

Yoshiki Manabe

Soyoung Lee

Hyunwoo Kim

Akio Saito

Atsushi Yamashita

Kiyoshi Murata

Jaesoon Lim

Jaewoon Kim

An organometallic compound and a method of manufacturing an integrated circuit (IC) device, the organometallic compound being represented by Formula (I),

Organometallic compound and method of manufacturing integrated circuit using the same

An organometallic adduct compound and a method of manufacturing an integrated circuit (IC) device, the organometallic adduct compound being represented by General formula (I):

Organometallic adduct compound and method of manufacturing integrated circuit using the same

An yttrium compound and a method of manufacturing an integrated circuit device, the compound being represented by General Formula (I):

Yttrium compound and method of manufacturing integrated circuit device by using the same

A molybdenum compound and a method of manufacturing an integrated circuit device, the molybdenum compound being represented by the following General Formula (I):

Molybdenum compound and method of manufacturing integrated circuit device using the same

A niobium compound and a method of forming a thin film using the niobium compound, the compound being represented by the following General formula I: 

Niobium compound and method of forming thin film

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Hwaseong-si, South Korea

Gyuhee Park