Cheil Industries Inc.

Gyu Seok Song

Jae Won Choi

Ji Ho Kim

Mi Sun Kim

Hye Jin Kim

Seung Jib Choi

Baek Soung Park

In Hwan Kim

Chang Beom Chung

Su Mi Lim

Jae Hyun Cho

Taek Jin Baek

Jin Man Kim

In Jae Song

Jin Ah Lee

Yong Ha Hwang

The present invention relates to a thermosetting composition for an organic light-emitting element filler, which comprises (A) 100 parts by weight of an epoxy-based resin including (A1) an epoxy resin having a weight average molecular weight of around about 200 g/mol or more to less than about 1000 g/mol, (A2) an epoxy resin having a weight average molecular weight of around about 1000 g/mol or more to less than about 20000 g/mol and (A3) an epoxy resin having a weight average molecular weight of about 20000 g/mol or more to less than about 100000 g/mol, (B) about 10 parts by weight to about 40 parts by weight of a sheet-like filler and (C) about 0.1 parts by weight to about 20 parts by weight of an imidazole curing agent having a cyano group; and an organic light-emitting element display device comprising the same.

Thermosetting composition for organic light-emitting element filler and organic light-emitting element display device comprising same

A heat dissipation adhesive film, a semiconductor device including the same, and a method of fabricating the semiconductor device, the heat dissipation adhesive film being placeable between a protective layer encasing a semiconductor element therein and a heat dissipation metal layer on the protective layer to bond the protective layer to the heat dissipation metal layer, wherein an adhesive strength between the heat dissipation adhesive film and the protective layer and an adhesive strength between the heat dissipation adhesive film and the heat dissipation metal layer are each about 3 kgf/25 mmor greater.

Adhesive film for heat dissipation, semiconductor device including the same, and method of fabricating the semiconductor device

An adhesive film includes an amine curing agent and a phenolic curing agent, and has a ratio of a storage modulus at 170&#xb0; C. after 80% or more curing to a storage modulus at 40&#xb0; C. before curing in the range of about 1.5 to about 3.0.

Adhesive film and electronic device including the same

A multifunction tape for a semiconductor package and configured to bond to a device-formed side of a semiconductor substrate having a plurality of devices thereon while performing a process of grinding a side of the semiconductor substrate opposite to the device-formed side and a process of dicing the semiconductor substrate into individual chips with a dicing tape having a UV-curable adhesive layer bonded to the ground side of the semiconductor substrate, the multifunction tape being bonded to the individual chips while the individual chips, separated from each other by the dicing process, are picked up and die-attached and a method of manufacturing a semiconductor device using the same, the multifunction tape including a base film; a UV-curable adhesive layer on one side of the base film; and first and second bonding layers on the adhesive layer.

Multi-function tape for a semiconductor package and method of manufacturing a semiconductor device using the same

Growing community of inventors

Uiwang-si, South Korea

Gyu Seok Song