Samsung Display Co., Ltd.

Gyu-po Kim

Ki-beom Lee

Sam-Young Cho

Won-guk Seo

Hyun-cheol Shin

Seung-yeon Han

Hong-Sick Park

Bong-Kyun Kim

Jong-Hyun Choung

In-Bae Kim

Wang-Woo Lee

Sang-woo Kim

Young-woo Park

Youngmin Moon

Hong Sick Park

Hongsick Park

Young-jun Kim

Hyun-Cheol Shin

Jae Woo Jeong

Seungbo Shim

Jinsuek Kim

Seon-II Kim

Changwoo Kwon

Ilbae Ahn

Seokjun Jang

Ji-hun Park

Yong-su Lee

Yangil Jeon

An etchant composition of an embodiment may etch a multi-layered film of titanium/copper and may include about 5 wt % to about 20 wt % of persulfate, about 0.1 wt % to about 5 wt % of phosphoric acid or phosphate, about 0.01 wt % to about 2 wt % of a carbonyl ring compound, about 0.01 wt % to about 1 wt % of a 3-nitrogen ring compound, about 0.1 wt % to about 2 wt % of a 4-nitrogen ring compound, about 0.1 wt % to about 0.9 wt % of a fluorine compound, about 0.1 wt % to about 0.5 wt % of hydrogen about 1 wt % to about 3 wt % of a zwitterionic compound, and sulfate, water which is included in an amount that makes the total weight of the entire composition about 100 wt %.

Etchant composition, and method for manufacturing metal pattern and thin film transistor substrate using the same

An etchant composition including 0.5 wt % to 20 wt % of a persulfate, 0.01 wt % to 1 wt % of a fluorine compound, 1 wt % to 10 wt % of an inorganic acid, 0.01 wt % to 2 wt % of an azole-based compound, 0.1 wt % to 5 wt % of a chlorine compound, 0.05 wt % to 3 wt % of a copper salt, 0.01 wt % to 5 wt % of an antioxidant or a salt thereof, based on a total weight of the etchant composition, and water in an amount sufficient for the total weight of the etchant composition to be equal to 100 wt % is disclosed. The etchant composition is suitable for use in forming a metal wiring by etching a metal layer including copper or in fabricating a thin film transistor substrate for a display apparatus.

Etchant composition and methods of fabricating metal wiring and thin film transistor substrate using the same

An etchant composition includes about 25 percent by weight to about 35 percent by weight of phosphoric acid, about 3 percent by weight to about 9 percent by weight of nitric acid, about 10 percent by weight to about 20 percent by weight of acetic acid, about 5 percent by weight to about 10 percent by weight of a nitrate, about 6 percent by weight to about 15 percent by weight of a sulfonic acid, about 1 percent by weight to about 5 percent by weight of an amine compound including a carboxyl group, about 0.1 percent by weight to about 1 percent by weight of a water-soluble amino acid, about 0.01 percent by weight to about 1 percent by weight of an azole compound, and water.

Etchant composition, and method of manufacturing a display substrate using the same

A metal wire etchant including persulfate, a sulfonate, a fluorine compound, an azole-based compound, an organic acid, a nitrate, and a chlorine compound, and a method of making the same.

Metal wire etchant and method of forming metal wire using the same

An etching composition for a copper-containing layer includes about 0.1% to about 30% by weight of ammonium persulfate, about 0.1% to about 10% by weight of a sulfate, about 0.01% to about 5% by weight of an acetate and about 55% to about 99.79% by weight of water. The etching composition having improved stability during storage and an increased capacity for etching.

Etching composition, method of forming a metal pattern and method of manufacturing a display substrate

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Hwaseong-si, South Korea

Gyu-po Kim