Samsung Electro-mechanics Co., Ltd.

Gyu Man Hwang

Dae Hyeong Lee

Ji Hwan Shin

Ki Pyo Hong

Byeung Gyu Chang

Bong Gyun Kim

A ceramic elements module including ceramic elements that have a plurality of lower inserting grooves; an electronic component that is mounted on a lower surface of the ceramic elements; and a heat sink that is coupled with a lower part of the ceramic elements mounted with the electronic component and has a first penetrating hole corresponding to the lower inserting groove and a second penetrating hole into which the electronic component is inserted.

Ceramic elements module

A substrate and a method for manufacturing the same, and a probe card employing the substrate as a space transformer. The substrate includes: a substrate body; a key forming groove formed in one surface of the substrate body; and an alignment key formed on the key forming groove. The recognition rate of the alignment key formed on the substrate can be increased, resulting in improved accuracy in a micro electro mechanical system (MEMS) process for forming micro probes on the substrate, thereby improving productivity and reliability of the substrate and the probe card including the same.

Substrate and method for manufacturing the same, and probe card

A method for manufacturing a ceramic elements module. The method includes providing a ceramic elements that has a plurality of lower inserting grooves; mounting an electronic component on a lower surface of the ceramic elements; providing a heat sink that has a first penetrating hole corresponding to the lower inserting groove and a second penetrating hole into which the electronic component is inserted to a lower part of the ceramic elements; coupling the ceramic elements with the heat sink; engaging a fixing member with the lower inserting groove of the ceramic elements by passing through the first penetrating hole of the heat sink; and removing the fixing member.

Method for manufacturing a ceramic elements module

Disclosed is a power package for an electrical device of an Electronic Control Unit (ECU) in an Electric Power Steering (EPS) system, the power package including: a housing which is formed with an upper part and a lower part and is formed to be in a two-step structure where substrate layers are provided on each of the upper and lower parts; a Printed Circuit Board (PCB) layer which is provided on the lower part of the housing and has a path line formed thereon to flow a current; and an LTCC layer which is provided on the upper part of the housing, is connected to the PCB layer through wire-bonding, and is formed of a Low Temperature Co-fired Ceramics. The power package for an electrical device can expand areas of the PCB and LTCC layers, thereby enhancing freedom degree of design of the PCB and LTCC layers and reducing a size of the entire case.

Optimized power package for electrical device

There is provided a method of manufacturing a multi-layer ceramic condenser. A method of manufacturing a multi-layer ceramic condenser may include: laminating a plurality of dielectric green sheets having internal electrodes formed thereon to form a laminate; forming through holes in a region of the laminate where an external electrode is to be formed; filling the through holes with conductive paste to form the external electrode; cutting the laminate having the external electrode formed thereon; and firing the cut laminate to form at least one multi-layer ceramic condenser.

Growing community of inventors

Yongin-si, South Korea

Gyu Man Hwang