Lg Innotek Co., Ltd.

Lg Electronics Inc.

Suzhou Lekin Semiconductor Co., Ltd.

Gyu Hyeong Bak

Sang Won Lee

Bong Kul Min

Song Eun Lee

Sung Min Hwang

Sung Joo Oh

Byung Yeon Choi

Yong Seon Song

Keal Doo Moon

Chang Hyeong Lee

Dae Geun Kim

Seul Ki Kim

Muyng Gi Kim

Kyung Min Je

Kyoung Un Kim

Tae Uk Ha

Myoung Kyo Kim

A semiconductor device according to an embodiment may include a light emitting structure, a first electrode, a second electrode, a first insulating reflective layer, a second insulating reflective layer, a first bonding pad, and a second bonding pad. The light emitting structure may include a first conductivity type semiconductor layer and a second conductivity type semiconductor layer. The first insulating reflective layer may be disposed on the first electrode and the second electrode, and may include a first opening exposing an upper surface of the first electrode. The second insulating reflective layer may be disposed on the first electrode and the second electrode, and disposed spaced apart from the first insulating reflective layer, and may include a second opening exposing an upper surface of the second electrode. The first bonding pad may be electrically connected to the first electrode through the first opening. The second bonding pad may be electrically connected to the second electrode through the second opening.

Semiconductor device and semiconductor device package

A light-emitting device package according to an embodiment provides a light-emitting device including a light-emitting structure having a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer; a package body; first and second lead frames disposed in the package body and disposed to be electrically isolated from each other; a first solder portion of a solid state disposed between the first lead frame and the first conductive semiconductor layer, the first solder portion having a uniform area and an even thickness; and a second solder portion of a solid state disposed between the second lead frame and the second conductive semiconductor layer, the second solder portion having a uniform area and an even thickness.

Light-emitting device package and light-emitting apparatus comprising same

An embodiment comprises: a substrate having a chip mounting region; first and second wiring layers disposed on the substrate around the chip mounting region so as to be spaced apart from each other; and a plurality of light emitting chips disposed on the chip mounting region, wherein the first wiring layer comprises a first wiring pattern disposed at one side of a reference line and having a first concave part, and a first extending pattern extending from the first wiring pattern to the other side of the reference line, the second wiring layer comprises a second wiring pattern disposed at the other side of the reference line and having a second concave part, and a second extending pattern extending from the second wiring pattern to one side of the reference line, and the reference line is a straight line passing through the center of the chip mounting region.

Light emitting device package

Disclosed are a light emitting device and a lighting apparatus having the same. The light emitting device includes a plurality of lead frames, a first body having non-transmissive resin material on top surfaces of the lead frames, a second body having transmittance resin material on a top surface of the first body, a light emitting chip on at least one of the lead frames exposed in the first opening of the second body, and a first transmissive layer disposed in the first opening of the second body. The first body and the second body is disposed around the light emitting chip.

Light emitting device and lighting apparatus having the same

Provided is a light emitting apparatus. The light emitting apparatus includes a substrate; a light emitting device on the substrate; a fluorescent layer formed on the substrate and the light emitting device to surround the light emitting device; an encapsulant resin layer formed on the substrate and the fluorescent layer to surround the fluorescent layer; and a lens disposed on the light emitting device and supported by the substrate, wherein the lens includes a lens body having a first recess formed at a center of a top surface of the lens body and a second recess formed at a center of a bottom surface of the lens body, and a lens supporter provided at the bottom surface of the lens body to support the lens body such that the lens body is spaced apart from the substrate.

Light emitting apparatus

Embodiments provide a light emitting device package including a first lead frame including a first contact area and a first exposed area, a second lead frame spaced apart from the first lead frame, the second lead frame including a second contact area and a second exposed area, a bottom portion located between the first contact area and the first exposed area, between the second contact area and the second exposed area, and between the first contact area and the second contact area, a light emitting device electrically connected to the first and second contact areas, and a package body having a cavity configured to expose the first and second contact areas, the first and second exposed areas, and the bottom portion, wherein the bottom portion has a thermal expansion coefficient greater than a thermal expansion coefficient of the first and second lead frames.

Disclosed are a light emitting device and a lighting apparatus having the same. The light emitting device includes a plurality of lead frames, a first body having reflectance, disposed on top surfaces of the lead frames and having an open region at a predetermined region of the top surfaces of the lead frames, a second body having transmittance, having a first opening corresponding to the open region of the first body, and disposed on a top surface of the first body, a light emitting chip on at least one of the lead frames exposed in the first opening of the second body, and a first resin layer disposed in the first opening of the second body to cover the light emitting chip.

A light emitting device package is disclosed. The light emitting device package includes a body, first and second lead frames disposed on the body, and a light emitting device connected to the first and second lead frames, wherein at least one of the first and second lead frames includes first and second regions having different thicknesses.

Light emitting device package and lighting system including the same

Provided is a lens. The lens includes a lens body including a convex top surface having a first recessed part at a central portion thereof and a flat surface at a circumference thereof and a flat bottom surface having a second recessed part at a central portion thereof; and a plurality of lens supports on the bottom surface of the lens body, wherein a ratio of a maximum depth (a) of the first recessed part, from the top surface of the lens body to a bottom surface of the first recessed part, to a maximum thickness (h) of the lens body, from the top surface of the lens body to the bottom surface of the lens body, ranges from 0.06 to 0.1.

Growing community of inventors

Seoul, South Korea

Gyu Hyeong Bak