Cypress Semiconductor Corporation

Seagate Technology Incorporated

Gyu-Chul Kim

Igor G Kouznetsov

Sungkwon Lee

Youngpil Kim

A device including both drain extended metal-on-semiconductor (DE_MOS) and low-voltage metal-on-semiconductor (LV_MOS) transistors and methods of manufacturing the same are provided. In one embodiment, the method includes implanting ions of a first-type at a first energy level in a drain portion of a first DE_MOS transistor in a DE_MOS region of a substrate to form the first DE_MOS transistor, and implanting ions of the first-type at a second energy level in a LV_MOS region of the substrate adjust a voltage threshold of a first LV_MOS transistor, while concurrently implanting ions of the first-type at the second energy level in the drain portion of the first DE_MOS transistor to form a drain extension of the first DE_MOS transistor. Other embodiments are also provided.

Method of forming drain extended MOS transistors for high voltage circuits

The disclosed technology provides enables incremental step pulse programming (ISPP) operations with variable pulse step height control. In particular, a storage device is configured to select a pulse step height for an ISPP operation of one or more memory cells of a storage device based on a write frequency of data programmed via the ISPP operation. The storage device saves the data by applying a series of electrical pulses to the one or more memory cells, each subsequent pulse increasing in magnitude by the selected pulse step height.

Growing community of inventors

Lakeville, MN, United States of America

Gyu-Chul Kim