Samsung Display Co., Ltd.

Philoptics Co., Ltd

Samsung Displayco., Ltd.

Gyoo Wan Han

Emil Aslanov

Je Kil Ryu

Alexander Voronov

Hae Sook Lee

Akifumi Sangu

Il Young Jeong

Hyoung-Joo Kim

Tae Yong Kim

Kyung Hoon Chung

Cheol Lae Roh

Gyeong Hee Han

Seung Ho Myoung

Ki Su Han

Eun Sun Choi

Sung Yong Lee

Jeong Hun Woo

Jong Nam Moon

Ku Hyun Kang

Cheol Ho Park

Toshinaru Suzuki

Young Su Chae

Tae Hyoung Cho

Young Geun Cho

Jin Hong Jeun

Vladimir Tokarev

A laser crystallization apparatus according to an embodiment includes: a light source unit which irradiates a laser beam; and a path conversion unit which converts the laser beam incident from the light source unit into a linear beam having a long axis parallel to a first direction and a short axis parallel to a second direction. The linear beam propagates in a third direction perpendicular to the first direction and the second direction, the path conversion unit includes an incident window extending parallel to a first length direction, an emission window extending parallel to a second direction, a first reflection unit disposed at the same side with the incident window, and a second reflection unit disposed at the same side with the emission window, and the second length direction extends parallel to the first direction in a view of the third direction.

Laser crystallization apparatus

A laser processing apparatus according to an exemplary embodiment includes: a light source generating a laser beam; and a light converging unit converging the laser beam to a focal point on an object to be processed, wherein the light converging unit includes a first optical element including a through hole penetrating the first optical element; a second optical element including a first region reflecting the laser beam and a second region transmitting the laser beam; and a third optical element including a focusing lens as a convex lens, a lower surface of the first optical element is a concave mirror, and an upper surface of the second optical element is convex and a lower surface thereof is concave.

Laser processing apparatus

A laser apparatus includes: a first vacuum chamber, wherein machining is performed on a target substrate in the first vacuum chamber; a laser facing the first vacuum chamber; a carrier disposed in the first vacuum chamber, wherein the target substrate is seated on the carrier; a chamber window disposed in one surface of the first vacuum chamber, wherein a laser beam emitted by the laser passes through the chamber window; a first protection window positioned between the carrier and the chamber window; a second vacuum chamber disposed at a first side of the first vacuum chamber; and a transfer unit configured to transfer the first protection window to the second vacuum chamber.

Laser apparatus and laser machining method

A laser processing apparatus includes a laser source which generates a laser beam; a scanner unit disposed in an optical path of the laser beam from the laser source and which adjusts the optical path of the laser beam from the laser source in a first direction or in a second direction different from the first direction; and a reflector unit disposed in an optical path of the laser beam adjusted by the scanner unit and which reflects the laser beam adjusted by the scanner unit, where the reflector unit includes a first sub-reflector unit which shifts an optical path of the laser adjusted by the scanner unit in the first direction, and a second sub-reflector unit which shifts an optical path of the laser beam adjusted by the scanner unit in a third direction opposite to the first direction.

A laser processing apparatus includes a light source configured to generate a laser beam, and a light converging optical system configured to converge laser beam to a focal point at an object to be processed, the light converging optical system including a through-hole optical element and a composite optical element under the through-hole optical element, wherein the through-hole optical element includes a first recess portion configured as a concave mirror at a lower surface of the through-hole optical element, and wherein an upper surface of the composite optical element is convex and includes a first region configured to reflect the laser beam and a second region configured to transmit the laser beam.

A laser processing apparatus includes: a scanner configured to adjust a path of at least one of a first laser beam and a second laser beam; and a lens unit configured to condense the first laser beam and the second laser beam received from the scanner. The scanner may include a first reflection member for providing the first laser beam to the lens unit and a second reflection member for providing the second laser beam to the first reflection member.

An F-theta lens includes a diffractive optical element and a plurality of spherical lenses. The diffractive optical element includes multi-level diffractive structure having three or more levels and defined on a surface thereof, and the diffractive optical element is arranged before the spherical lenses on a path of a laser beam.

F-theta lens having diffractive optical element and optical system including the F-theta lens

A patterning apparatus includes a laser generator, at least one lens, a detector, and a controller. The laser generator generates a first laser beam and a second laser beam having different intensities. The at least one lens irradiates the first laser beam to form a pattern in a substrate, irradiates a second laser beam to determine a defect of the pattern, and condenses reflected beams generated as the second laser beam is reflected from the substrate. The detector converts the reflected beams to electrical signals. The controller determines a defect of the pattern based on the electrical signals.

Patterning apparatus and operating method thereof

A shearing interferometer includes first and second shearing plates disposed opposite to each other. The first shearing plate includes a first front surface and a first back surface, and splits an input beam input to the first front surface into first and second beams reflected at the first front and back surfaces, respectively. The second shearing plate includes a second front surface and a second back surface. The second shearing plate splits the first beam into third and fourth beams reflected at the second front and back surfaces, respectively, and splits the second beam into fifth and sixth beams reflected at the second front and back surfaces, respectively. Each of the first and second shearing plates has a thickness which limits a phase delay between the fourth beam and the fifth beam to a degree determined to allow interference to occur between the fourth beam and the fifth beam.

Shearing interferometer using two opposing shearing plates for laser

A laser processing apparatus includes a laser beam generating unit which emits a laser beam, a lens unit which divides the laser beam into a plurality of laser beams, and a light condensing unit which condenses the plurality of laser beams. The lens unit includes a first lens array having a first central axis and a second lens array having a second central axis, and wherein at least one of the first lens array and the second lens array reciprocates such that the first central axis and the second central axis are deviated from each other.

Laser processing apparatus and method for manufacturing the same

A method for cutting a substrate includes: radiating, as part of a first laser radiating process, a laser towards a surface of the substrate to form a first groove in a substrate. Radiating the laser towards the surface includes radiating, in sequence, the laser towards a first outer point (FOP), a second outer point (SOP), a first intermediate point (FIP), a second intermediate point (SIP), and a first cut point (FCP) of the surface, each of the points being spaced apart from one another by one or more distances. The FCP corresponds to a cut line of the substrate. The FOP and the SOP are respectively disposed at lateral sides of the FCP. The FIP is disposed between the FCP and the FOP. The SIP is disposed between the FCP and the SOP. The same kind and intensity of laser is radiated towards each of the points.

Method for cutting substrate

A method of excimer laser annealing includes generating a focused long line beam with a laser beam output from at least one laser source; and scanning the long line beam in a direction perpendicular to a long axis of the long line beam along a surface of an amorphous semiconductor film on a substrate. The long line beam has a normalized beam angular divergence half-width &#x3c6;=arctan(tan &#x3b8;/sin &#x3b8;) that is less than a critical value &#x3c6;, where &#x3b8;represents a beam angular divergence half-width measured along the long axis of the long line beam on the surface of the amorphous semiconductor film, &#x3b8; represents a mean incidence angle of the long line beam on the surface of the amorphous semiconductor film, and &#x3c6;is approximately 30&#xb0;.

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Yongin-si, South Korea

Gyoo Wan Han