Moda-innochips Co., Ltd.

Innochips Technology Co., Ltd.

Gyeong Tae Kim

In Kil Park

Seung Hun Cho

Jun Ho Jung

Ki Joung Nam

Myung Ho Lee

Tae Geun Seo

Tae Hyung Noh

Jung Gyu Lee

Sang Jun Park

In-Kil Park

Tae-Hyung Noh

Kyu Cheol Jang

Min Soo Lee

Sang Hwan Lee

Sang Hyup Lee

Song Yeon Lee

Jae Ho Han

Heon Guk Ha

Sang Hyun Kim

Disclosed are a power inductor and a method of manufacturing the same. The power inductor includes a body, a coil pattern provided in the body, an external electrode disposed on at least one surface of the body and extending to at least the other surface of the body, which is adjacent thereto, and a coupling layer provided between the body and an extended area of the external electrode.

Power inductor and manufacturing method therefor

Provided is a power inductor. The power inductor includes a body including metal powder and an insulation material, at least one base provided in the body, at least one coil pattern disposed on at least one surface of the base, and an external electrode disposed on each of at least two side surfaces of the body. At least a portion of the external electrode is made of the same material as the coil pattern.

Power inductor

Provided is a power inductor. The power inductor includes a body including metal powder and a polymer, at least one base provided in the body, and at least one coil pattern disposed on at least one surface of the base. The metal powder includes at least three metal powder of which middle values of grain-size distribution are different from each other.

Provided is a power inductor. The power inductor includes a body including magnetic powder and a polymer, at least one base provided in the body and having at least one surface on which at least one coil pattern is disposed, and an insulation layer disposed between the coil pattern and the body. The body includes at least region in which the magnetic powder having a particle size different from that of the magnetic power in a remaining region is distributed.

Provided is a power inductor. The power inductor includes a body, at least one base material disposed within the body, at least one coil pattern disposed on at least one surface of the base material, an insulation layer disposed between the coil pattern and the body, and an external electrode disposed outside the body and connected to the coil pattern. The body includes a magnetic pulverized material and an insulation material.

The present disclosure discloses a circuit protection device including a first magnetic layer in which a plurality of magnetic sheets are laminated and of which at least a portion of one surface is exposed, a second magnetic layer in which a plurality of magnetic sheets are laminated and of which at least a portion of one surface is exposed, and a nonmagnetic layer in which a plurality of nonmagnetic sheets are laminated and which is disposed between the first and second magnetic layers. A noise filter part including a plurality of coil patterns is disposed in the nonmagnetic layer.

Element for protecting circuit

Provided is a method of forming a coil pattern on at least one surface on a substrate, the method comprising forming a seed layer on at least one surface of a substrate, and forming at least two or more plating layers to cover the seed layer, wherein the two or more plating layers are formed through anisotropic plating.

Coil pattern, method for forming same, and chip device including same

Provided is a coil pattern formed on at least one surface of a substrate and including a first plating film formed on the substrate and a second plating film formed to cover the first plating film, a method of forming the coil pattern, and a chip device provided with the coil pattern.

Coil pattern and formation method therefor, and chip element having same

Provided is a power inductor. The power inductor includes a body, at least one base material disposed within the body, at least one coil pattern disposed on at least one surface of the base material, an insulation film disposed between the coil pattern and the body, and an external electrode disposed outside the body and connected to the coil pattern. The body includes a plurality of magnetic layers and insulation layers, which are alternately laminated.

In accordance with an exemplary embodiment, a power inductor includes a body, a base disposed in the body, and a coil pattern disposed on at least one surface of the base, in which the body includes metal powder, a polymer, and a thermal conductive filler and the base is formed by bonding a copper foil to both surfaces of a metal plate comprising iron.

The present disclosure provides a power inductor, which includes a body, at least one substrate provided inside the body, at least one coil pattern provided on at least one surface of the substrate, and an insulation layer formed between the coil pattern and the body, wherein the insulation layer is formed of parylene.

The present invention suggests a power inductor comprising: a body; at least one substrate provided on the inside of the body; at least one coil pattern provided on at least one surface of the substrate; and an insulating layer formed between the coil pattern and the body, wherein at least a part of the substrate is removed and the body is filled in a region where the substrate is removed.

In accordance with an exemplary embodiment, a power inductor includes a body, at least two bases disposed in the body, a plurality of coil patterns disposed on at least one surface of the at least two the base, respectively, and a connection electrode disposed on an outer portion of the body and connecting the at least two coils to each other.

Provided are a power inductor including a body, a base disposed in the body, a coil disposed on the base, a first external electrode connected to the coil, the first external electrode being disposed on a side surface of the body, and a second external electrode connected to the first external electrode, the second external electrode being disposed on a bottom surface of the body and a method for manufacturing the same.

Power inductor and method for manufacturing the same

Provided is a laminated chip device including a first laminate in which a plurality of conductor patterns formed on a plurality of sheets are connected to each other through a via formed to penetrate at least a sheet, and a second laminate provided over or below the first laminate and having a plurality of internal electrode patterns formed on a plurality of sheets, and the internal electrode patterns have a non-conductive region in at least a portion of an area corresponding to the via.

Growing community of inventors

Ansan-si, South Korea

Gyeong Tae Kim