Industrial Technology Research Institute

Tpo Displays Corporation

Toppoly Optoelectronics Corporation

Gwo-long Lin

I-Wei Wu

I-Min Lu

Dai-Liang Ting

Kang-Cheng Lin

Shyuan-Jeng Ho

Chi-Jain Wen

Chu-Jung Shih

Chih-Fang Chen

Yeong-E Chen

Jr-Hong Chen

Hong-Woei Wu

A transflective liquid crystal display and method of fabricating the same. The pixel region of the transflective comprises a thin film transistor, a transmissive electrode, and a reflective electrode, wherein the overlap of the reflective electrode and the transparent electrode composes a reflective region and the non-overlapping region of the reflective electrode and the transparent electrode form a transmissive region, and the transparent electrode and the source and the drain regions of the thin film transistor are formed of the same silicon layer.

Transflective liquid crystal display and method of fabricating the same

A method of fabricating an array of structures sensitive to ESD is disclosed. First, an array of structures is provided on a substrate, with the structures conductively coupled by interconnections. Thereafter, the interconnections are removed before fabricating another array of structures. Therefore, the structures have equal potential. Further, an electrostatic discharge structure is provided near the periphery of the substrates.

Method of an array of structures sensitive to ESD and structure made therefrom

A six mask-steps method for fabricating liquid crystal display is described. A driving area and a pixel area are defined by a first mask step. Gates on the driving/pixel area and upper electrodes of capacitors on the pixel area are defined by a second mask step. Then, using the gates and the upper electrodes as a mask, a source/drain, channel region and lower electrode are formed in the driving/pixel area by an ion-doping process. A second insulation layer is formed and covers the insulation substrate. A plurality of first openings is formed by the third mask step and the gate and the source/drain are exposed. A second conductive layer is formed and covers the second insulation layer and the first opening is filled. Then, the second conductive layer is patterned, and a source/drain line is formed and contacts electrically with the source/drain by the fourth mask step. A dielectric layer is formed and covers the second insulation layer and the second conductive layer; the dielectric layer has a planar surface. A second opening is formed by the fifth mask step and the drain line on the pixel area is exposed. Finally, a pixel electrode is defined by the sixth mask step and contacts electrically with the drain line.

Method for fabricating liquid crystal display

A process for manufacturing a TFT without the use of ion implantation is described. Instead, heavily doped layers of amorphous silicon are used as diffusion sources. Two embodiments of the invention are described. In the first embodiment the gate pedestal is deposited first, followed by gate oxide and an amorphous layer of undoped silicon. This is followed by the layer of heavily doped amorphous silicon which is subjected to a relatively low energy laser scan which drives in a small amount of dopant and converts it to N-. After the N+ layer has been patterned and etched to form source and drain electrodes, a second, higher energy, laser scan is given. This brings the source and drain very close to, but not touching, the channel, resulting in an LDD type of structure. In the second embodiment a layer of intrinsic polysilicon is used for the channel. It is covered with a layer of gate oxide and a metallic gate pedestal. As before, heavily doped N+ amorphous silicon is deposited over this and used as a source of dopant to produce an LDD structure similar to the first embodiment.

Process to manufacture LDD TFT

The present invention includes patterning a metal layer on a glass substrate. A dielectric layer is formed on the metal layer. An amorphous silicon layer is subsequently formed on the dielectric layer. A first positive photoresist is formed on the amorphous silicon layer. Then, a back-side exposure is used by using the gate electrodes as a mask. A bake step is performed to expand the lower portion of the photoresist. Next, a second positive photoresist layer is formed on the amorphous silicon layer and the residual first positive photoresist layer. A further back-side exposure is employed again from the back side of the substrate using the gate electrode as the mask. A second back step is applied to expand the lower portion of the second positive photoresist layer. An ion implantation is performed by using the second positive photoresist as a mask. Next, the substrate is then annealed. Amorphous silicon layer is then patterned. A further dielectric layer for isolation is formed on the patterned amorphous silicon layer. Source and drain are patterned on the dielectric layer to contact with the amorphous silicon layer. Subsequently, a passivation layer is deposited on the source and drain.

Method of fabricating a TFT-LCD

Growing community of inventors

Hsinchu, Taiwan

Gwo-long Lin