Playnitride Inc.

Genesis Photonics Inc.

National Central University

Gwo-Jiun Sheu

Po-Jen Su

Yun-Li Li

Sheng-Yuan Sun

Kuan-Yung Liao

Tai-Cheng Tsai

Shou-Wen Hsu

Tai-Wei Wu

Jyh-Chen Chen

Jun-Yu Lin

Chih-Chiang Lu

Yi-Ching Chen

Yu-Chu Li

Pei-Hsin Chen

Hsin-Hung Lin

Yi-Chun Shih

Cheng-Yen Chen

Ying-Tsang Liu

Farn-Shiun Hwu

Wen-Jie Lu

Ping-Tsung Tsai

Pei-Yi Huang

Bing-Jung Chen

A display panel includes a first substrate, a plurality of first color micro light emitting diodes (LEDs), a plurality of second color LEDs and a shading layer. The first substrate has a plurality of pixel zones arranged in an array form. Each of the first color LEDs has a first light emitting surface facing to a display direction. Each of the second color LEDs has a second light emitting surface facing to the display direction. Each of the pixel zones is provided with one of the first color micro LEDs and one of the second color LEDs. The shading layer is disposed in the pixel zones. The shading layer overlaps part of the first light emitting surface and part of the second light emitting surface in the display direction.

Display panel

An optical module including a reflecting component, a plurality of first light sources and a wavelength conversion body is provided. The reflecting component has a main axis and a focal point located on the main axis. The first light sources are located at one side of the reflecting component and each of the first light sources emits a first light parallel to the main axis towards the reflecting component. The wavelength conversion body is disposed on the focal point, wherein the first lights are reflected to the focal point via the reflecting component and a part of the first lights are converted to a second light via the wavelength conversion body. The second light and another part of the first lights are projected to the reflecting component and form a light beam parallel to the main axis via reflection by the reflecting component.

Optical module

A light source module is adapted to perform a light irradiation process on an object. The light source module includes a transparent cover, a reflector and a light emitting unit. The reflector covers the transparent cover, and the reflector and the transparent cover define a containing space. The light emitting unit is disposed inside the containing space. A perpendicular working distance from the transparent cover to the object is WD, a semi-minor axis of the reflector is A, and a semi-major axis of the reflector is B, wherein WD=2 A-3 to 3.5 A-3, and B=2 A to 2.5 A.

Light source module

A light-emitting module including a light emitting component, a heat dissipation element, and a light-converting component is provided. The light-emitting component is adapted to emit a light beam. The heat dissipation element is disposed at one side of the light-emitting component, wherein the heat dissipation element has a light through hole and the light through hole is located at a transmission path of the light beam. The light-converting component is connected to the heat dissipation element and covers the light through hole.

Light-emitting module

An optical module including a light source, an adjustable reflector and a wavelength conversion set is provided. The adjustable reflector is disposed in a light path of light emitted from the light source and adaptable to adjust between a first position and a second position. The wavelength conversion set includes a first wavelength conversion member and a second wavelength conversion member. When the adjustable reflector is at the first position, light emitted from the light source is reflected to the first wavelength conversion member by the adjustable reflector. When the adjustable reflector is at the second position, light emitted from the light source is reflected to the second wavelength conversion member by the adjustable reflector.

A light-emitting module that includes a light source and an optical lens is provided. The light source emits an original beam along a direction of a light-emitting axis, and the optical lens is disposed on a transmission path of the original beam. The original beam passes the optical lens and becomes an illumination beam. A light shape of the illumination beam has a first full width at half maximum (FWHM) along a first direction and has a second FWHM along a second direction, and a ratio of the second FWHM to the first FWHM is large than 3. The first direction and the second direction are perpendicular to the direction of the light-emitting axis. A light-emitting device is also provided.

Light-emitting module and light-emitting device

An optical assembly that is adapted to be located at a light path of light emitted from at least one light source and spaced apart from the at least one light source by a distance is provided. The optical assembly includes a wavelength converting device, which is a spatial structure, and a reflector. The reflector covers a portion of the wavelength converting device and exposes at least a portion of a region of at least one surface of the wavelength converting device. The light emitted from the at least one light source enters or leaves the wavelength converting device from at least the portion of area which is not covered by the reflector. An optical module including the light source and the optical assembly is further provided.

Optical assembly and optical module

A detection apparatus for light-emitting diode chips comprises a transparent chuck with the light-concentration capability, a probing device and a light-sensing device. The transparent chuck comprises a light-incident plane and a light-emitting plane. The light-incident plane is used to bear a plurality of light-emitting diode chips under detection. The probing device comprises two probe pins and a power supply. The two ends of each probe pin is electrically connected to one of the light-emitting diode chips and the power supply, respectively, to make the light-emitting diode chip emit a plurality of light beams. The light beams penetrate through the transparent chuck by emitting into the incident plane of the transparent chuck. The light-sensing device is disposed on one side of the light-emitting plane of the transparent chuck to receive the light beams which penetrate through the transparent chuck.

Detection apparatus for light-emitting diode chips having a light sensing device receiving light beams penetrated through a transparent chuck

A detection apparatus for light-emitting diode chip comprising a substrate with the function of photoelectric conversion and a probing device is disclosed. The substrate is designed to bear at least one light-emitting diode chip. The probing device comprises a power supply and at least two conductive elements. The two ends of the conductive elements are respectively electrically connected to the light-emitting diode chip and the power supply to enable the light-emitting diode chip to emit light beams. Some of the light beams are emitted from the light-emitting diode chip toward the substrate such that the light beams emitted by the light-emitting diode chip are converted into an electric signal by the substrate.

Detection apparatus for light-emitting diode chip

An electronic device including an insulating substrate, a chip and a patterned conductive layer is provided. The insulating substrate has an upper surface and a lower surface opposite to each other. The chip is disposed above the upper surface of the insulating substrate. The patterned conductive layer is disposed between the upper surface of the insulating substrate and the chip. The chip is electrically connected to an external circuit via the patterned conductive layer. Heat generated by the chip is transferred to external surroundings via the patterned conductive layer and the insulating substrate.

Electronic device

A detection apparatus comprising a chuck, a probe device, a light-sensing device and a light-concentrating unit is disclosed. The chuck bears light-emitting diode chips. The probe device includes two probes and a power supply. The end point of the probes respectively electrically connects with one of the light-emitting diode chips and the power supply to make the light-emitting diode chip emits a plurality of light beams. The light-sensing device is disposed on one side of a light-emitting surface of the light-emitting diode chip so as to receive the light beams emitted by the light-emitting diode chip. The light-concentrating unit is disposed between the light-emitting diode chip and the light-sensing device to concentrate the light beams emitted by the light-emitting diode chip.

Detection apparatus

A heat shield and a crystal growth equipment are provided, in which the length-adjustable and hybrid-angle heat shield is provided for the crystal growth equipments. The heat shield is adapted for not only guiding the inert gas flow but also speeding up the flow rate of the gas and the cooling rate of the crystal so as to raise the axial temperature gradient at the solid-molten interface, the growth rate of the crystal and the productivity. The heat shield further can also reduce the possibility of microdefect nucleation to improve the quality of crystal at the same time. In addition, the length of heat shield can be adjusted according to the distance between the heat shield and the semiconductor material melt in different crucibles in case that the crucibles are made by different factories. This can reduce the cost of the heat shield manufacturing.

Heat shield and crystal growth equipment

A method of producing lithium aluminosilicate (LAS) ceramics, which uses a mixing powder of lithium carbonate, aluminum oxide, and silicon oxide as a raw material powder. After being mixed by ball milling and baked dry, the raw material powder is processed with a calcinations process such that the raw material powder becomes a precursor. The precursor is then pressed into the green ceramic. Significantly, the high heat conducting metal sheets are tightly attached above and below the surfaces of the ceramic during sinter and heat-treatment processes. A solid-state sinter process is performed with the green ceramic. Next, the ceramic is treated with a proper heat-treatment process. Since the top and bottom surfaces of the ceramic are capped with the high heat conducting metal, the ceramics are uniformly heated during all the heating processes. The ceramics of this invention exhibit more uniform properties and stable structure, which allow them to be used as temperature compensation components and athermal products.

Growing community of inventors

Tainan, Taiwan

Gwo-Jiun Sheu