Samsung Electronics Co., Ltd.

Gwangsik Park

Wookrae Kim

Myungjun Lee

Jaehwang Jung

Changhoon Choi

Sungho Jang

Jungchul Lee

Juntaek Oh

Jinseob Kim

Minhwan Seo

Wondon Joo

Kwangsoo Kim

Hyejin Shin

Daehoon Han

Jiyoung Chu

Janghwi Lee

Yongju Jeon

A low-cost digital holography microscope (DHM) that is capable of performing inspection at high speed while accurately inspecting an inspection object at high resolution, an inspection method using the DHM, and a method of manufacturing a semiconductor device by using the DHM are provided. The DHM includes: a light source configured to generate and output light; a beam splitter configured to cause the light to be incident on an inspection object and output reflected light from the inspection object; and a detector configured to detect the reflected light, wherein, when the reflected light includes interference light, the detector generates a hologram of the interference light, and wherein no lens is present in a path from the light source to the detector.

Digital holography microscope (DHM), and inspection method and semiconductor manufacturing method using the DHM

Provided is a hyperspectral imaging (HSI) apparatus. The HSI apparatus includes: a first slit plate configured to introduce an output beam; a first aspherical mirror configured to reflect the introduced output beam; a first grating having a planar reflective surface, the first grating configured to generate a plurality of first split beams by splitting the output beam after being reflected by the first aspherical mirror; and a first camera configured to detect the plurality of first split beams.

Hyperspectral imaging (HSI) apparatus and inspection apparatus including the same

An imaging apparatus includes a light source configured to generate and output light, a stage having a measurement target thereon, a line-scan spectral imaging (SI) optical system configured to measure the measurement target using a first scale and to slopingly irradiate the light from the light source onto the measurement target in a line beam shape, divide light reflected by the measurement target, and perform imaging of the divided light, and an angle-resolved SI optical system configured to measure the measurement target at a second scale that is smaller than the first scale and configured to divide the light from the light source into monochromatic light, slopingly irradiate the monochromatic light onto the measurement target by using a reflective objective lens, and perform imaging of light reflected by the measurement target.

Multi-scale spectral imaging apparatuses and methods, and methods of manufacturing semiconductor devices by using the imaging methods

Provided is a wafer inspection apparatus including a monochromator that extracts monochromatic light, a collimator that outputs the monochromatic light as parallel light, a first polarization assembly that polarizes the parallel light and radiates the polarized light to a wafer, an imaging optical system that condenses light reflected from the wafer, a spectroscope that splits the condensed light into a plurality of spectrums, a first lens that condenses the plurality of spectrums, a second polarization assembly that outputs the plurality of spectrums as a plurality of polarized lights having different diffraction orders and a difference of 90&#xb0;, a second lens that condenses the plurality of polarized lights, a third polarization assembly that outputs common polarized light based on the plurality of polarized interfering with each other, a camera that generates a phase difference image based on the common polarized light, and a signal processor that analyzes the phase difference image.

Wafer inspection apparatus

An inspection apparatus includes a first optical module including a first light source configured to emit first light to a semiconductor structure, a second light source configured to emit second light different from the first light to a portion adjacent to a portion to which the first light is emitted in the semiconductor structure, a detector configured to detect the second light reflected toward the second light source, and a lock-in amplifier connected to the first optical module and the detector.

Inspection apparatus and semiconductor structure-manufacturing apparatus including the same

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Hwaseong-si, South Korea

Gwangsik Park