Samsung Electronics Co., Ltd.

Gwangjin Lee

Jaehyun Lim

Inho Choi

Yun Seok Choi

Heeyoub Kang

Hyunjong Moon

A fingerprint sensor package includes a first substrate having a core insulating layer with a first surface and a second surface, and a through-hole passing through the first surface and the second surface, a first bonding pad disposed on the second surface of the core insulating layer, and an external connection pad, a second substrate disposed in the through-hole of the core insulating layer and including a plurality of first sensing patterns, a plurality of second sensing patterns, and a second bonding pad, a conductive wire connecting the first bonding pad and the second bonding pad to each other, a controller chip disposed on the second substrate, and a molding layer disposed on the second surface of the core insulating layer, filling the through-hole, covering the second substrate and the first bonding pad, and spaced apart from the external connection pad.

Fingerprint sensor package and smart card including fingerprint sensor package

A smart card including a fingerprint sensor package is provided. The fingerprint sensor package includes first sensing patterns, second sensing patterns, ground patterns, and a controller integrated circuit (IC). The first sensing patterns extend in a first direction. The second sensing patterns are disposed on the first sensing patterns and extend in a second direction crossing the first direction. The ground patterns are between the first sensing patterns and the controller IC.

Growing community of inventors

Bucheon-si, South Korea

Gwangjin Lee