Samsung Electronics Co., Ltd.

Gwang-Man Lim

Seok-Jae Han

Il-Mok Kang

Ki-Woong Yoo

In-Jae Lee

Seok-cheon Kwon

Sang-chul Kang

Seok-chan Lee

Seok-heon Lee

Jae-bum Lee

In-jae Lee

Kun-dae Yeom

Chul Woo Park

Soo-Jung Lee

Seok-Cheon Kwon

Seok-Chan Lee

Chul Hwan Park

Sang-Chul Kang

Hyeong-seob Kim

Hysong-seob Kim

Jae-bum Byun

A memory card and an electronic system including the memory card. The memory card includes: a substrate having two pairs of edges, in which the edges of each pair face each other; a plurality of first row terminals that are arranged adjacent to an edge at an insertion side of the substrate and include a first voltage power terminal; a plurality of second row terminals that are spaced farther apart from the edge at the insertion side than the plurality of first row terminals and include a power terminal of a second voltage. According to the memory card, efficient use of an area may be maximized and an electrically stable power supply may be provided.

Memory card

A memory card is provided to include a substrate having two pairs of edges facing each other, a plurality of first row terminals that are arranged adjacent to an edge at an insertion side of the substrate and include a first voltage power terminal for applying a first voltage and a first ground terminal, a plurality of second row terminals that are spaced farther apart from the edge at the insertion side than the plurality of first row terminals and include a second voltage power terminal for applying a second voltage and first data terminals, and a plurality of third row terminals that are spaced farther apart from the edge at the insertion side than the plurality of second row terminals and include second data terminals.

Provided is a memory card, which includes two pairs of opposite edges, first row terminals arranged adjacent to an insertion-side edge of the memory card, and second row terminals arranged apart from the insertion-side edge of the memory card. The memory card can be easily reset in terms of software without controlling power supply in terms of hardware. Also, the memory card can be smoothly attached and detached during insertion of the memory card into a socket and reduce damage to a device.

Memory card having multi-row terminals

A memory card adaptor may include a plurality of card-side terminals arranged to contact terminals of a memory card, a plurality of socket-side terminals arranged in a first direction to contact terminals of a host socket and including at least two socket-side ground terminals, wiring lines configured to electrically connect the plurality of card-side terminals to the plurality of socket-side terminals in a one-to-one correspondence, a ground frame configured to electrically connect the at least two socket-side ground terminals to each other, and a housing that accommodates the plurality of card-side terminals, the plurality of socket-side terminals, and the wiring lines. The memory card adaptor may have good electrical characteristics, and thus may be able to stably operate even during fast data transmission.

Memory card adapter

A storage device includes: a first semiconductor device mounted on a substrate; a housing accommodating the substrate, with the substrate fixed on a first fixing unit that is coupled to a first surface of the housing; and a first thermal conductive plate disposed between the first semiconductor device and the housing, with the first thermal conductive plate thermally connected to the housing, wherein the first thermal conductive plate has a thermal conductivity that is higher than that of the substrate. Thus, the storage device may dissipate heat generated by the semiconductor device rapidly to the outside or away from the storage device.

Storage device

Provided is a semiconductor package including multiple semiconductor chips, and separate groups of leads connected to the semiconductor chips. The leads are exposed to the outside of the semiconductor package. The plurality of leads may include a first lead group for a first chip group and a second lead group for a second chip group. The first and second chip groups are part of the package.

Semiconductor package including multiple chips and separate groups of leads

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Seoul, South Korea

Gwang-Man Lim