Samsung Electronics Co., Ltd.

Gwan Yong Lee

Cheol Seong Hwang

Dohyun Ahn

A printed circuit board of a camera module according to various embodiments of the disclosure includes: a ground portion constructed on the printed circuit board; a conductive member which is disposed to cover the ground portion and includes a first opening at a location corresponding to the ground portion; and an adhesive layer which is interposed between the printed circuit board and the conductive member and includes a second opening at a location corresponding to the ground portion, wherein the conductive member may be electrically coupled to the ground portion through a solder constructed on the first opening and the second opening. Other embodiments are also possible.

Growing community of inventors

Gyeongsangbuk-do, South Korea

Gwan Yong Lee