Smartrac I.p. B.v.

Other

On Track Innovations Ltd.

On Track Innovation Ltd.

Guy Shafran

Oded Bashan

Tom Rahav

Dudu Lev

Ronnle Gilboa

A method for manufacture of an electronic interface card including defining a pair of apertures in a substrate layer, associating an antenna with the substrate layer such that opposite ends of the antenna terminate at the apertures, placing a metal element in each of the apertures, connecting the ends of the antenna to the metal elements, laminating the substrate layer together with a top layer and a bottom layer, forming a recess in the top layer and the substrate layer, attaching ends of connection wires to the metal elements, attaching opposite ends of the connection wires to a chip module and sealing the chip module in the recess.

Electronic interface apparatus and method and system for manufacturing same

A method for manufacture of an electronic interface card () including defining a pair of apertures in a substrate layer (), associating an antenna () with the substrate layer () such that opposite ends of the antenna () terminate at the apertures, placing a metal element in each of the apertures, connecting the ends of the antenna to the metal elements, laminating the substrate layer together with a top layer () and a bottom layer (), forming a recess () in the top layer and the substrate layer, attaching end of connection wires () to the metal elements, attaching opposite ends of the connection wires () to a chip module () and sealing the chip module in the recess ().

A method for manufacture of a contactless smart card device including mounting at least one antenna and at least one smart card module onto a substrate layer, placing aramagnetic material over at least part of the at least one antenna, and laminating the substrate layer and the paramagnetic material to provide a laminate.

Contactless smart sticker

A method for manufacture of an electronic interface card including defining a pair of apertures in a substrate layer, associating an antenna with the substrate layer such that opposite ends of the antenna terminate at the apertures, placing a conductor in each of the apertures, connecting the antenna to the conductor, forming a recess in the substrate layer, attaching continuous connection wires to a plurality of chip modules, attaching the continuous connection wires to a plurality of conductors on a corresponding plurality of the substrate layers, cutting the continuous connection wires so as to retain portions thereof which connect each chip module to a corresponding pair of conductors and sealing the chip module in the recess.

Method and system for manufacturing an electronic interface apparatus

A method for manufacture of a contactless smart card device including mounting at least one antenna and at least one smart card module onto a substrate layer, placing paramagnetic material over at least part of the at least one antenna, and laminating the substrate layer and the paramagnetic material to provide a laminate.

A mobile communicator including a housing including a main portion and a removable portion, cellular telephone circuitry located within the main portion of the housing, a SIM card mounted in the main portion of the housing, a battery mounted between the removable portion of the housing and the SIM card and a contactless functionality antenna mounted intermediate the removable portion and the battery and communicating with the SIM card.

Contactless smart SIM

An electronic inlay structure including first and second sheets of an inlay substrate arranged in generally side to side, spaced parallel arrangement, having a gap therebetween, a flexible web material arranged to overlie the gap and edges of the first and second sheets of the inlay structure adjacent the gap, third and fourth sheets arranged in registration with the first and second sheets respectively, over the first and second sheets of the inlay substrate and partially over the flexible web material and bonded thereto, electronic circuitry associated with at least one of the first, second, third and fourth sheets and lamination enclosing the first, second, third and fourth sheets, the electronic circuitry and the web material together to create the inlay structure.

Growing community of inventors

Rosh-Pina, Israel

Guy Shafran