Samsung Sdi Co., Inc.

Samsung Co., Ltd.

Guy-Seong Kim

Won-Kyu Bang

A plasma display apparatus includes a plasma display panel, a chassis base having a first surface to which the plasma display panel is attached and a second surface on which a driving circuit module is installed, and at least one gripper provided on the second surface of the chassis base, the gripper being integrally formed with the chassis base, the gripper being protruded with respect to the second surface of the chassis base. A technique of manufacturing a chassis base for a plasma display apparatus, includes applying a press working process to a chassis base body to provide a chassis base, forming a pair of parallel incision lines on the chassis base, and pressing a portion partitioned by the incision lines toward a thickness direction of the chassis base to form a grip body.

Plasma display apparatus and method of manufacturing chassis base used therefor

There is provided a plasma display apparatus capable of reducing the cost and complexity of fitting circuit boards to a chassis base. The plasma display apparatus comprises a plasma display panel (PDP), a chassis base having a first side attached to the PDP, the first side also supporting the PDP, and circuit boards provided at a second side of the chassis base opposite to the first side attached to the PDP. The chassis base has at least one boss and at least one supporter disposed thereon, which correspond to holes disposed in a circuit board.

Plasma display apparatus

A chassis structure for a plasma display module, and a plasma display module including the chassis structure effectively dissipate heat generated by a plasma display panel and improve assembly of the plasma display module. The chassis base includes: a front plate; a back plate separated from the front plate; and a heat dissipation member disposed between the front plate and the back plate, and having a bent cross-section arranged so that some surfaces of the heat dissipation member contact the front plate and some surfaces of the heat dissipation member contact the back plate to allow air flow between the front and back plate.

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Suwon-si, South Korea

Guy-Seong Kim